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M74VHC1GT02DFT1G-L22038

Onsemi

M74VHC1GT02DFT1G-L22038 by Onsemi

M74VHC1GT02DFT1G-L22038 by Onsemi is a logic gate with 2 inputs, 15.5 ns propagation delay, and 3V nominal voltage. It is used in applications requiring fast signal processing in compact spaces due to its small outline, thin profile package style.

Median Price

$0.054

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 15,000 parts In-Stock

1+ parts

$0.054

100+ parts

-

1k+ parts

-

10k+ parts

$0.042

15,000

$0.054

-

-

$0.042

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,081 parts In-Stock

1+ parts

$0.051

100+ parts

-

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10k+ parts

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1,081

$0.051

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.062

100+ parts

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100

$0.062

-

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Flip Electronics

USA . 766,000 parts In-Stock

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766,000

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Vyrian

USA . 8,595 parts In-Stock

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8,595

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14,541 parts In-Stock

1+ parts

$0.046

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-

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14,541

$0.046

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Corphita

USA . 1,692 parts In-Stock

1+ parts

$0.049

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1,692

$0.049

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Corohmni

South Africa . 228 parts In-Stock

1+ parts

$0.054

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228

$0.054

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Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$0.062

100+ parts

$0.059

1k+ parts

$0.056

10k+ parts

$0.055

1,000

$0.062

$0.059

$0.056

$0.055

Microchip USA

USA . 12,529 parts In-Stock

1+ parts

$0.314

100+ parts

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12,529

$0.314

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AZTECH Wire

Italy . 157 parts In-Stock

1+ parts

$10.330

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157

$10.330

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Component Stockers USA

USA . 712 parts In-Stock

1+ parts

$99.990

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712

$99.990

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Kulean Microsystems

USA . 6,480 parts In-Stock

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6,480

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TANS Electronics

Latvia . 6,376 parts In-Stock

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6,376

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SupplyDigital Components

Austria . 6,117 parts In-Stock

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6,117

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Problanco Electronics

Mexico . 3,531 parts In-Stock

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3,531

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UHIMA Technologies

Türkiye . 988 parts In-Stock

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988

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Overview

Discover the cutting-edge M74VHC1GT02DFT1G-L22038 logic gate by Onsemi, a leading manufacturer known for their top-quality products. Ideal for various applications, this logic gate offers a fast propagation delay of 15.5 ns and operates at a nominal supply voltage of 3V. With its compact size and surface-mount capability, this product is perfect for space-constrained projects. Experience improved efficiency and performance with this reliable logic gate from Onsemi.

Feature Benefit Bullets

Propagation Delay: 15.5 ns

The low propagation delay makes this logic gate suitable for fast operation.

Surface Mount: YES

Being surface mountable saves space and allows for easy integration into electronic devices.

No. of Inputs: 2

With 2 inputs, this logic gate can perform basic logic operations effectively.

Package Shape: RECTANGULAR

The rectangular shape provides compatibility with standard PCB layouts.

Nominal Supply Voltage: 3V

Operating at a low supply voltage makes this logic gate energy efficient.

Load Capacitance: 50 pF

The low load capacitance ensures minimal interference with other components in the circuit.

No. of Terminals: 5

With 5 terminals, this logic gate can easily connect to other components in the circuit.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style saves space and allows for high-density circuit design.

Maximum I (ol): 8 Amp

The high maximum output current allows for driving of heavy loads.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this logic gate is suitable for various environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable performance in cold conditions.

Terminal Position: DUAL

The dual terminal position provides flexibility in PCB layout design.

Maximum Seated Height: 1.1 mm

The low seated height makes this logic gate suitable for slim electronic devices.

Width: 1.25 mm

The narrow width allows for placement in tight spaces on the PCB.

Minimum Supply Voltage: 2V

The ability to operate at a low supply voltage is advantageous for energy-efficient applications.

Length: 2 mm

The compact length of the logic gate saves space on the PCB.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections during soldering.

Packing Method: TR

The TR packing method ensures safe transportation and storage of the logic gates.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density PCB layout.

Maximum Supply Voltage: 5.5V

With a high maximum supply voltage, this logic gate can withstand voltage fluctuations.

Maximum Power Supply Current: 50 mA

The low power supply current consumption is ideal for battery-operated devices.

Technical Specifications

Logic Gates M74VHC1GT02DFT1G-L22038 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-XDSO-G5

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

15.5 ns

Propagation Delay (tpd):

15.5 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

M74VHC1GT02DFT1G-L22038 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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