Loading...

LV51139T-TLM-E

Onsemi

LV51139T-TLM-E by Onsemi

LV51139T-TLM-E by Onsemi is a Power Management IC with 1.5/10V power supplies, 8 terminals, and CMOS technology. It has a small outline package shape suitable for surface mount applications. Operating b/w -30 to 85 °C, it features tin/bismuth terminal finish and 0.013mA max supply current.

Median Price

$0.794

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$0.779

1k+ parts

$0.647

10k+ parts

$0.577

18,000

-

$0.779

$0.647

$0.577

Verical

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.809

10k+ parts

$0.721

18,000

-

-

$0.809

$0.721

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,110 parts In-Stock

1+ parts

$0.607

100+ parts

-

1k+ parts

-

10k+ parts

-

1,110

$0.607

-

-

-

Vyrian

USA . 5,978 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,978

-

-

-

-

Bristol Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 729 parts In-Stock

1+ parts

$0.575

100+ parts

-

1k+ parts

-

10k+ parts

-

729

$0.575

-

-

-

Corohmni

South Africa . 192 parts In-Stock

1+ parts

$0.639

100+ parts

-

1k+ parts

-

10k+ parts

-

192

$0.639

-

-

-

Component Stockers USA

USA . 18,450 parts In-Stock

1+ parts

$0.660

100+ parts

$0.620

1k+ parts

$0.560

10k+ parts

$0.560

18,450

$0.660

$0.620

$0.560

$0.560

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$5.172

100+ parts

$4.707

1k+ parts

$4.241

10k+ parts

-

100

$5.172

$4.707

$4.241

-

AZTECH Wire

Italy . 161 parts In-Stock

1+ parts

$17.280

100+ parts

-

1k+ parts

-

10k+ parts

-

161

$17.280

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,956 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,956

-

-

-

-

Kepictronics

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

Continental Prestige Electronics

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$0.647

1k+ parts

-

10k+ parts

-

18,000

-

$0.647

-

-

Kulean Microsystems

USA . 7,948 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,948

-

-

-

-

SupplyDigital Components

Austria . 7,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,885

-

-

-

-

Microchip USA

USA . 3,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,517

-

-

-

-

Problanco Electronics

Mexico . 894 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

894

-

-

-

-

UHIMA Technologies

Türkiye . 683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

683

-

-

-

-

TANS Electronics

Latvia . 242 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

242

-

-

-

-

Overview

Upgrade your power management capabilities with the LV51139T-TLM-E by Onsemi. Designed with quality and precision, this Power Management IC offers unmatched reliability and performance. Perfect for a wide range of applications, this product provides efficient power supplies from 1.5 to 10 volts, enhancing the functionality of your devices. Say goodbye to worries about temperature limits with a maximum operating temperature of 85 °C and a minimum of -30°C. Trust in Onsemi's expertise and invest in the future of your technology with the LV51139T-TLM-E today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good insulation and protection for the IC, making it durable and reliable.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the IC onto a PCB, saving space and reducing manufacturing costs.

Power Supplies (V): 1.5/10

Wide range of power supply compatibility allows the IC to be used in various applications with different voltage requirements.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for multiple input and output connections.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile of the package make it suitable for applications with space constraints, while the shrink pitch enhances thermal performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows for reliable operation in cold environments or during temperature fluctuations.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth terminal finish provides good solderability and corrosion resistance, ensuring secure connections.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the IC energy-efficient and reliable.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the IC is sensitive to moisture but can be handled and processed in a typical factory environment with standard precautions.

Technical Specifications

Power Management ICs LV51139T-TLM-E attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.5/10

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.013 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV51139T-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20