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LV51136T-TLM-E

Onsemi

LV51136T-TLM-E by Onsemi

LV51136T-TLM-E by Onsemi is a Power Management IC with 6/8V power supplies, 8 terminals, and CMOS technology. It features a small outline package shape suitable for surface mount applications. Operating b/w -30 to 85 °C, it is ideal for various electronic devices requiring efficient power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,136 parts In-Stock

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Digiode

USA . 1,826 parts In-Stock

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AZTECH Wire

Italy . 240 parts In-Stock

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$18.940

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240

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Component Stockers USA

USA . 550 parts In-Stock

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$99.990

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550

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Kulean Microsystems

USA . 7,705 parts In-Stock

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Problanco Electronics

Mexico . 6,034 parts In-Stock

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TANS Electronics

Latvia . 3,002 parts In-Stock

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SupplyDigital Components

Austria . 1,972 parts In-Stock

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UHIMA Technologies

Türkiye . 697 parts In-Stock

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Corohmni

South Africa . 388 parts In-Stock

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Corphita

USA . 330 parts In-Stock

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Microchip USA

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Overview

Enhance your power management solutions with the LV51136T-TLM-E by Onsemi. This top-quality Power Management IC offers unparalleled reliability and performance, backed by the trusted manufacturer Onsemi. Ideal for a wide range of applications, this product delivers efficiency and precision in every use. Experience the value and benefits of seamless power management with the LV51136T-TLM-E - a game-changer for all your power supply needs. Trust Onsemi to provide you with the best in class products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the Power Management IC.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Power Supplies (V): 6/8

Supporting a range of power supplies from 6V to 8V makes this Power Management IC versatile and suitable for a variety of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this Power Management IC can withstand elevated temperatures without compromising performance.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and efficient operation, making this Power Management IC energy-efficient and cost-effective.

Technical Specifications

Power Management ICs LV51136T-TLM-E attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

6/8

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.013 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV51136T-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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