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LV51135T-TLM-E

Onsemi

LV51135T-TLM-E by Onsemi

LV51135T-TLM-E by Onsemi is a Power Management IC with 1.5/10V power supplies, 8 terminals, and CMOS technology. It operates b/w -30 to 80 °C, suitable for commercial extended temperature applications requiring low supply current of 0.013mA in a small outline package.

Median Price

$1.548

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$1.520

1k+ parts

$1.260

10k+ parts

$1.120

4,000

-

$1.520

$1.260

$1.120

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.575

10k+ parts

$1.400

2,000

-

-

$1.575

$1.400

Distributors (In-Stock)

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Digiode

USA . 1,169 parts In-Stock

1+ parts

$1.188

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1,169

$1.188

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Vyrian

USA . 4,243 parts In-Stock

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4,243

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Distributors (Availability)

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Corphita

USA . 2,067 parts In-Stock

1+ parts

$1.125

100+ parts

-

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2,067

$1.125

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Corohmni

South Africa . 256 parts In-Stock

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$1.250

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256

$1.250

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AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$19.080

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638

$19.080

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QUARKTWIN TECHNOLOGY LTD

USA . 29,853 parts In-Stock

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29,853

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SupplyDigital Components

Austria . 6,813 parts In-Stock

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6,813

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Kulean Microsystems

USA . 6,689 parts In-Stock

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6,689

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TANS Electronics

Latvia . 5,117 parts In-Stock

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5,117

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Problanco Electronics

Mexico . 4,431 parts In-Stock

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4,431

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Continental Prestige Electronics

USA . 4,000 parts In-Stock

1+ parts

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100+ parts

$1.260

1k+ parts

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4,000

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$1.260

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

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1,500

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Metaverse IC Inc.

Canada . 1,044 parts In-Stock

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1,044

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Microchip USA

USA . 202 parts In-Stock

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202

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Perfect Parts

USA . 56 parts In-Stock

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56

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UHIMA Technologies

Türkiye . 41 parts In-Stock

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41

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-

Overview

Enhance the efficiency of your power management systems with the LV51135T-TLM-E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that guarantee optimal performance. This versatile product is designed for a wide range of applications, offering customers unmatched value and benefits. With its compact package style and advanced technology, the LV51135T-TLM-E provides reliability and precision in power supply solutions. Upgrade your systems today with Onsemi's innovative Power Management ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mounting allows for easy and efficient installation on PCBs, saving time and space in the assembly process.

Power Supplies (V): 1.5/10

The wide range of power supply options allows flexibility in designing power management solutions for different voltage requirements.

No. of Terminals: 8

Having multiple terminals enables connectivity to different components, enhancing the versatility of the power management IC.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature, this product can withstand heat without compromising performance, ensuring reliability in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this power management IC energy-efficient and reliable.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that this product can withstand moderate exposure to moisture during storage or handling, increasing its durability.

Technical Specifications

Power Management ICs LV51135T-TLM-E attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.5/10

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.013 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV51135T-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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