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LV51131T-TLM-E

Onsemi

LV51131T-TLM-E by Onsemi

LV51131T-TLM-E by Onsemi is a Power Management IC with 6/8V power supplies, BICMOS technology, and 0.65mm terminal pitch. It is used in power supply support circuits, featuring a small outline package for compact applications. Operating b/w -30 to 85 °C, it suits various electronic devices requiring efficient power management.

Median Price

$1.252

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 48 parts In-Stock

1+ parts

$1.660

100+ parts

$1.090

1k+ parts

$0.746

10k+ parts

$0.624

48

$1.660

$1.090

$0.746

$0.624

DigiKey

USA . 58,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

58,000

-

-

-

-

Flip Electronics (Authorized)

USA . 58,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

58,000

-

-

-

-

Rochester

USA . 247 parts In-Stock

1+ parts

-

100+ parts

$0.845

1k+ parts

$0.702

10k+ parts

$0.625

247

-

$0.845

$0.702

$0.625

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,025 parts In-Stock

1+ parts

$0.658

100+ parts

-

1k+ parts

-

10k+ parts

-

2,025

$0.658

-

-

-

Vyrian

USA . 2,032 parts In-Stock

1+ parts

$0.693

100+ parts

-

1k+ parts

-

10k+ parts

-

2,032

$0.693

-

-

-

Flip Electronics

USA . 58,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

58,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,632 parts In-Stock

1+ parts

$0.624

100+ parts

-

1k+ parts

-

10k+ parts

-

1,632

$0.624

-

-

-

Corohmni

South Africa . 291 parts In-Stock

1+ parts

$0.693

100+ parts

-

1k+ parts

-

10k+ parts

-

291

$0.693

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 7,024 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,024

-

-

-

-

Problanco Electronics

Mexico . 7,001 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,001

-

-

-

-

Kulean Microsystems

USA . 4,416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,416

-

-

-

-

Microchip USA

USA . 2,474 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,474

-

-

-

-

UHIMA Technologies

Türkiye . 877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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877

-

-

-

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SupplyDigital Components

Austria . 603 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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603

-

-

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Metaverse IC Inc.

Canada . 523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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523

-

-

-

-

Kepictronics

USA . 423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

423

-

-

-

-

TANS Electronics

Latvia . 157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

157

-

-

-

-

Overview

Enhance your power management capabilities with the LV51131T-TLM-E by Onsemi. This high-quality Power Management IC offers unmatched reliability and performance, thanks to Onsemi's reputation for excellence in manufacturing. Ideal for a wide range of applications, this product provides customers with efficient power supply support circuitry in a compact and versatile package. Experience the value and benefits of this innovative technology, designed to optimize your power management needs with ease and precision. Trust Onsemi to deliver cutting-edge solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and simplifying the assembly process.

Package Shape: SQUARE

Enables efficient use of space on the circuit board, ideal for compact designs.

Power Supplies (V): 6/8

Supports multiple power supply options, giving flexibility in usage scenarios.

No. of Terminals: 8

Provides ample connection points for various functions and interfaces.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enhances the overall aesthetics of the product and allows for easy integration into different designs.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -30 °C

Allows for operation in cold conditions without compromising functionality.

Terminal Finish: TIN BISMUTH

Provides a reliable and durable surface finish for the terminal connections.

Terminal Position: DUAL

Offers flexibility in installation orientations and methods.

Maximum Seated Height: 1.1 mm

Low-profile design saves space and allows for compact product layouts.

Width (mm): 3 mm

Compact width enables integration into tight spaces or small device designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed for power management, ensuring optimal performance and efficiency.

Minimum Supply Voltage (Vsup): 6 V

Works with a wide range of supply voltages, making it versatile and compatible with various systems.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures during reflow soldering processes, ensuring robust manufacturing.

Peak Reflow Temperature °C: 260

Able to endure high reflow temperatures for soldering without damage.

Length: 3 mm

Compact length allows for space-efficient PCB layouts and product designs.

Maximum Supply Current (Isup): 0.0169 mA

Efficient power consumption for conserving energy and prolonging battery life.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, providing high performance and low power consumption.

Terminal Form: GULL WING

Facilitates easy soldering and robust mechanical connections on the PCB.

Terminal Pitch: 0.65 mm

Fine pitch allows for high-density mounting on the PCB, saving space and enabling more features in a compact design.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow processes without the need for special handling, making manufacturing more efficient.

Maximum Supply Voltage (Vsup): 8 V

Supports higher voltage applications while still maintaining efficiency and reliability.

Technical Specifications

Power Management ICs LV51131T-TLM-E attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e6

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

6/8

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0169 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

LV51131T-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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