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LV51137T-TLM-E

Onsemi

LV51137T-TLM-E by Onsemi

LV51137T-TLM-E by Onsemi is a Power Management IC with 1.5/10V power supplies, 8 terminals, and CMOS technology. It has a small outline package shape suitable for surface mount applications. Operating temperature ranges from -30 to 85 °C making it ideal for various electronic devices.

Median Price

$0.885

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,500 parts In-Stock

1+ parts

-

100+ parts

$0.885

1k+ parts

$0.735

10k+ parts

$0.655

20,500

-

$0.885

$0.735

$0.655

DigiKey

USA . 20,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.750

10k+ parts

$0.750

20,500

-

-

$0.750

$0.750

Verical

USA . 20,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.918

10k+ parts

$0.819

20,500

-

-

$0.918

$0.819

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 398 parts In-Stock

1+ parts

$0.690

100+ parts

-

1k+ parts

-

10k+ parts

-

398

$0.690

-

-

-

Vyrian

USA . 916 parts In-Stock

1+ parts

$0.726

100+ parts

-

1k+ parts

-

10k+ parts

-

916

$0.726

-

-

-

DigiKey Marketplace

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 15,568 parts In-Stock

1+ parts

$0.620

100+ parts

-

1k+ parts

-

10k+ parts

-

15,568

$0.620

-

-

-

Corphita

USA . 481 parts In-Stock

1+ parts

$0.653

100+ parts

-

1k+ parts

-

10k+ parts

-

481

$0.653

-

-

-

Corohmni

South Africa . 344 parts In-Stock

1+ parts

$0.726

100+ parts

-

1k+ parts

-

10k+ parts

-

344

$0.726

-

-

-

SupplyDigital Components

Austria . 5,677 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,677

-

-

-

-

Authorized Procurement Solutions

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,800

-

-

-

-

TANS Electronics

Latvia . 2,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,232

-

-

-

-

Kulean Microsystems

USA . 2,189 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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2,189

-

-

-

-

Continental Prestige Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.735

1k+ parts

-

10k+ parts

-

2,000

-

$0.735

-

-

Problanco Electronics

Mexico . 1,588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,588

-

-

-

-

UHIMA Technologies

Türkiye . 893 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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893

-

-

-

-

Microchip USA

USA . 140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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140

-

-

-

-

Overview

Enhance your power management capabilities with the LV51137T-TLM-E by Onsemi. Crafted with precision using high-quality materials, this Power Management IC offers unrivaled performance and reliability. Perfect for a wide range of applications, this product delivers exceptional value and efficiency to customers. Say goodbye to power-related issues and welcome seamless operation with the LV51137T-TLM-E by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good insulation and protection for the components inside, making it durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing costs.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and functionalities, making it versatile for various power management applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure stable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, leading to efficient power management and better overall performance.

Technical Specifications

Power Management ICs LV51137T-TLM-E attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.5/10

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.013 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV51137T-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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