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LV51134T-TLM-E

Onsemi

LV51134T-TLM-E by Onsemi

LV51134T-TLM-E by Onsemi is a Power Management IC with 1.5/10V power supplies, 8 terminals, and CMOS technology. It has a temperature range of -30 to 80 °C and is used in power supply support circuits. The package is small outline, thin profile, with shrink pitch and Gull Wing terminals for surface mount applications.

Median Price

$0.832

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 82,000 parts In-Stock

1+ parts

-

100+ parts

$0.832

1k+ parts

$0.691

10k+ parts

$0.616

82,000

-

$0.832

$0.691

$0.616

Verical

USA . 64,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.864

10k+ parts

$0.770

64,000

-

-

$0.864

$0.770

DigiKey

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.710

10k+ parts

$0.710

18,000

-

-

$0.710

$0.710

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,322 parts In-Stock

1+ parts

$0.649

100+ parts

-

1k+ parts

-

10k+ parts

-

2,322

$0.649

-

-

-

Vyrian

USA . 902 parts In-Stock

1+ parts

$0.683

100+ parts

-

1k+ parts

-

10k+ parts

-

902

$0.683

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 45,183 parts In-Stock

1+ parts

$0.580

100+ parts

-

1k+ parts

-

10k+ parts

-

45,183

$0.580

-

-

-

Corphita

USA . 2,133 parts In-Stock

1+ parts

$0.615

100+ parts

-

1k+ parts

-

10k+ parts

-

2,133

$0.615

-

-

-

Corohmni

South Africa . 387 parts In-Stock

1+ parts

$0.683

100+ parts

-

1k+ parts

-

10k+ parts

-

387

$0.683

-

-

-

Kepictronics

USA . 100,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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100,000

-

-

-

-

Continental Prestige Electronics

USA . 82,000 parts In-Stock

1+ parts

-

100+ parts

$0.691

1k+ parts

-

10k+ parts

-

82,000

-

$0.691

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,763 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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26,763

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-

-

-

SupplyDigital Components

Austria . 7,526 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,526

-

-

-

-

TANS Electronics

Latvia . 5,809 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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5,809

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-

-

-

Problanco Electronics

Mexico . 5,566 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,566

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-

-

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Kulean Microsystems

USA . 3,010 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,010

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-

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UHIMA Technologies

Türkiye . 757 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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757

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-

-

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Microchip USA

USA . 359 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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359

-

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-

-

Overview

Enhance your power management system with the LV51134T-TLM-E by Onsemi. Crafted with precision and expertise, Onsemi delivers top-notch quality in Power Management ICs. This small outline, thin profile IC offers a wide range of applications, from consumer electronics to industrial machinery. With a temperature grade of commercial extended and a maximum operating temperature of 80 °C, this product ensures reliability and efficiency. Upgrade your power supplies to 1.5/10V with ease, thanks to the value and benefits that the LV51134T-TLM-E brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Power Supplies (V): 1.5/10

Provides flexibility in power supply options, catering to a wide range of electronic devices.

No. of Terminals: 8

Sufficient number of terminals for connecting various components in the circuit, enhancing functionality.

Maximum Operating Temperature: 80 °C

Can withstand high temperatures, making it suitable for devices that may operate in elevated temperature environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the product is less sensitive to moisture, ensuring reliability and longevity in various operating conditions.

Technical Specifications

Power Management ICs LV51134T-TLM-E attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.5/10

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.013 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV51134T-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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