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LC749000AT-8B15H

Onsemi

LC749000AT-8B15H by Onsemi

LC749000AT-8B15H by Onsemi is a consumer IC with 1.5V power supply, operating from -40 to 85 °C. It features a flatpack package style, quad terminal position, and CMOS technology. Ideal for industrial applications requiring a surface-mount square package with 120 terminals.

Median Price

$6.490

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 450 parts In-Stock

1+ parts

-

100+ parts

$6.490

1k+ parts

$5.810

10k+ parts

$5.460

450

-

$6.490

$5.810

$5.460

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,694 parts In-Stock

1+ parts

$6.850

100+ parts

-

1k+ parts

-

10k+ parts

-

1,694

$6.850

-

-

-

Chip Stock

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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21,000

-

-

-

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Vyrian

USA . 4,578 parts In-Stock

1+ parts

-

100+ parts

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4,578

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-

-

-

Flip Electronics

USA . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

450

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,507 parts In-Stock

1+ parts

$6.489

100+ parts

-

1k+ parts

-

10k+ parts

-

1,507

$6.489

-

-

-

Corohmni

South Africa . 267 parts In-Stock

1+ parts

$7.210

100+ parts

-

1k+ parts

-

10k+ parts

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267

$7.210

-

-

-

AZTECH Wire

Italy . 85 parts In-Stock

1+ parts

$12.850

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$12.850

-

-

-

TANS Electronics

Latvia . 6,897 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,897

-

-

-

-

Kulean Microsystems

USA . 5,906 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,906

-

-

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Problanco Electronics

Mexico . 5,378 parts In-Stock

1+ parts

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5,378

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-

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SupplyDigital Components

Austria . 3,616 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,616

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UHIMA Technologies

Türkiye . 551 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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551

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-

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Microchip USA

USA . 134 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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134

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-

-

Overview

Unleash the power of innovation with the LC749000AT-8B15H by Onsemi. Designed with precision and quality in mind, this consumer IC offers unmatched reliability and performance. Whether you're looking to enhance your electronic devices or streamline your operations, this product is the perfect solution. With its durable package body material and advanced technology, it ensures long-lasting functionality in a wide range of applications. Elevate your projects to new heights with the LC749000AT-8B15H - where quality meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for the product, making it suitable for consumer applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and cost.

Package Shape: SQUARE

Square package shape provides a compact design, saving space and allowing for more efficient PCB layout.

Power Supplies (V): 1.5

Operates on a low voltage of 1.5V, making it suitable for low power consumption applications.

No. of Terminals: 120

High number of terminals provide connectivity options for various functions, enhancing the versatility of the product.

Package Style (Meter): FLATPACK

Flatpack package style offers ease of handling and installation, ideal for industrial applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a range of environments and conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold conditions, increasing the product's usability.

Terminal Finish: TIN BISMUTH

TIN BISMUTH terminal finish provides good solderability and long-term reliability for the product.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Other Function Consumer ICs LC749000AT-8B15H attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G120

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

120

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP120,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LC749000AT-8B15H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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