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LC749460W

Onsemi

LC749460W by Onsemi

LC749460W by Onsemi is a consumer circuit IC with 256 terminals in a square flatpack package. It operates b/w -30 °C to 70°C, with power supplies of 1.2V and 3.3V. This CMOS technology IC is surface mountable and suitable for various consumer electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,418 parts In-Stock

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2,418

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Digiode

USA . 729 parts In-Stock

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729

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Distributors (Availability)

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SupplyDigital Components

Austria . 6,285 parts In-Stock

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6,285

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TANS Electronics

Latvia . 5,640 parts In-Stock

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5,640

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Kulean Microsystems

USA . 2,299 parts In-Stock

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2,299

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Problanco Electronics

Mexico . 1,491 parts In-Stock

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1,491

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Corphita

USA . 538 parts In-Stock

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538

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UHIMA Technologies

Türkiye . 510 parts In-Stock

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510

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Corohmni

South Africa . 310 parts In-Stock

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310

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Overview

Elevate your consumer electronics to the next level with the LC749460W by Onsemi. Known for their superior quality and innovation, Onsemi delivers cutting-edge solutions for a wide range of applications. This versatile consumer circuit IC offers unparalleled value and benefits, providing power supplies at 1.2V and 3.3V in a compact square package. With 256 terminals and advanced CMOS technology, the LC749460W is the ideal choice for your next project. Upgrade your products today with Onsemi's reliable and efficient solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protects the internal components of the IC, increasing the reliability and longevity of the product.

Surface Mount: YES

Being surface mountable makes this IC easy to install on a circuit board, offering convenience and efficient assembly in manufacturing processes.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, making this IC suitable for compact electronic designs.

Power Supplies (V): 1.2, 3.3

The availability of multiple power supply options (1.2V and 3.3V) provides flexibility in designing and using this IC in various electronic applications.

No. of Terminals: 256

With a high number of terminals, this IC can support complex circuit designs and connections, making it suitable for advanced electronic systems.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and compact form factor, making it ideal for applications where space is limited.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures the IC can perform reliably even in harsh environmental conditions or under heavy loads.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C allows the IC to function effectively in cold environments, increasing its versatility.

Terminal Position: QUAD

The quad terminal position provides multiple connection points for interfacing with other components, enhancing the IC's compatibility and integration capabilities.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high-speed operation, and noise immunity, making this IC energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable electrical connections, ensuring secure mounting of the IC on the circuit board.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm allows for high-density mounting of the IC on a circuit board, enabling efficient use of space and enhancing design flexibility.

Technical Specifications

Other Function Consumer ICs LC749460W attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G256

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP256,1.2SQ,16

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

LC749460W General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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