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LC7412

Onsemi

LC7412 by Onsemi

LC7412 by Onsemi is a 30-terminal IC with a 5V power supply, operating b/w -30 °C to 70°C. Housed in a rectangular plastic/epoxy package, it's ideal for consumer electronics applications requiring dual terminal positions and through-hole connections.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,885 parts In-Stock

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Vyrian

USA . 722 parts In-Stock

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MISTER SPROCKETS

USA . 75 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 33 parts In-Stock

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GES GmbH

Germany . 1 parts In-Stock

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TANS Electronics

Latvia . 7,413 parts In-Stock

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SupplyDigital Components

Austria . 4,452 parts In-Stock

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Kulean Microsystems

USA . 2,995 parts In-Stock

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Problanco Electronics

Mexico . 2,218 parts In-Stock

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UHIMA Technologies

Türkiye . 918 parts In-Stock

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Corphita

USA . 263 parts In-Stock

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Corohmni

South Africa . 210 parts In-Stock

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Kepictronics

USA . 192 parts In-Stock

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Glotronic Ltd.

UK . 32 parts In-Stock

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Assy Fe

Spain . 10 parts In-Stock

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Overview

Discover the LC7412 by Onsemi, a high-quality consumer IC that offers endless possibilities for your electronic projects. With its durable plastic/epoxy package and 30 terminals, this innovative device is designed to provide reliable performance in a wide range of applications. Whether you're a hobbyist or a professional, the LC7412's ease of use and versatility make it a must-have component for your next project. Trust in Onsemi's reputation for excellence and unlock the full potential of your creations with the LC7412.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the internal components of the IC, ensuring longer lifespan and reliability.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into circuit designs and PCB layouts, making it a versatile choice for various applications.

Power Supplies (V): 5

Operating at 5 volts ensures compatibility with a wide range of power sources, making it ideal for consumer electronics that commonly operate at this voltage.

No. of Terminals: 30

Having 30 terminals provides flexibility in connecting the IC to external components and peripherals, allowing for complex functionality and customization.

Package Style (Meter): IN-LINE

In-line package style saves space on the PCB layout, making it suitable for compact electronic devices where board real estate is limited.

Maximum Operating Temperature: 70 °C

Being able to operate at temperatures up to 70 °C ensures reliable performance in a variety of environmental conditions, enhancing the product's versatility.

Minimum Operating Temperature: -30 °C

Operating at temperatures as low as -30 °C allows for use in extreme cold environments, making it suitable for a wider range of applications.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved connectivity, reducing the risk of signal loss or disconnection in critical applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure mechanical and electrical connections, making it easier for hobbyists and professionals to solder and interface with the IC.

Technical Specifications

Other Function Consumer ICs LC7412 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T30

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP30(UNSPEC)

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

LC7412 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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