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LC74950BG

Onsemi

LC74950BG by Onsemi

LC74950BG by Onsemi is a consumer IC with 96 terminals in a square package. It operates b/w -30 to 70 °C, with power supplies of 1.5-3.3V. This CMOS technology IC is used in various consumer circuit applications due to its thin profile and fine pitch design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,739 parts In-Stock

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Digiode

USA . 1,619 parts In-Stock

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Problanco Electronics

Mexico . 7,429 parts In-Stock

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TANS Electronics

Latvia . 6,274 parts In-Stock

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SupplyDigital Components

Austria . 4,211 parts In-Stock

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Kulean Microsystems

USA . 4,161 parts In-Stock

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Corphita

USA . 2,066 parts In-Stock

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Corohmni

South Africa . 202 parts In-Stock

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UHIMA Technologies

Türkiye . 191 parts In-Stock

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Overview

Unleash the power of innovation with the LC74950BG by Onsemi. As a leading manufacturer in the industry, Onsemi continues to deliver top-quality consumer ICs like the LC74950BG, designed for a wide range of applications. From its durable plastic/epoxy package body to its advanced CMOS technology, this product offers unmatched reliability and performance. With a compact square design and surface mount capability, the LC74950BG provides ease of installation and integration. Experience seamless operation with power supplies ranging from 1.5V to 3.3V, making it versatile for various projects. Trust Onsemi to deliver cutting-edge solutions that exceed expectations, choose the LC74950BG for your next venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic package body material helps to keep the IC lightweight and durable, making it reliable for various consumer applications.

Surface Mount: YES

Being surface mountable, this IC can be easily integrated into a wide range of electronic devices without the need for through-hole mounting, saving space and enabling efficient assembly.

Package Shape: SQUARE

The square package shape allows for a compact design and efficient use of board space, making it suitable for applications where size is a critical factor.

Power Supplies (V): 1.5, 3.3

Supporting multiple power supply voltages makes this IC versatile and compatible with different electronic systems, providing flexibility in design and implementation.

No. of Terminals: 96

With a high number of terminals, this IC offers a wide range of connectivity options, enabling complex circuit designs and functionalities.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style allows for high-density mounting, enhancing the overall performance and reliability of the IC in densely populated electronic devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that this IC can perform reliably in elevated temperature environments, making it suitable for a variety of applications.

Minimum Operating Temperature: -30 °C

With a low minimum operating temperature, this IC can function effectively in cold environments, expanding its range of use cases.

Terminal Position: BOTTOM

Bottom terminal position facilitates efficient heat dissipation and can simplify the assembly process, contributing to the overall reliability of the IC.

Maximum Seated Height: 1.05 mm

The low maximum seated height allows for a slim profile design, making this IC suitable for applications where space constraints are critical.

Width: 6 mm

The compact width of the IC enables it to fit in tight spaces, enhancing its versatility and suitability for a wide range of consumer electronic products.

Minimum Supply Voltage (Vsup): 1.35 V

The low minimum supply voltage requirement ensures that this IC can operate efficiently even with limited power sources, making it energy-efficient.

Length: 6 mm

The short length of the IC contributes to its compact form factor, making it ideal for applications where size optimization is crucial.

Technology: CMOS

Utilizing CMOS technology, this IC offers low power consumption, high noise immunity, and fast switching speeds, making it suitable for a wide range of consumer applications.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections, ensuring robust performance and ease of installation in electronic systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density interconnections, enabling complex circuit designs and miniaturization of electronic products.

Maximum Supply Voltage (Vsup): 1.65 V

The moderate maximum supply voltage limits the voltage stress on the IC, enhancing its long-term reliability and performance.

Technical Specifications

Other Function Consumer ICs LC74950BG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3 TO 3.6 V SUPPLY

General IC Type:

JESD-30 Code:

S-PBGA-B96

Length:

6 mm

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,10X10,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.05 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.65 V

Minimum Supply Voltage (Vsup):

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

LC74950BG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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