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LC749880T

Onsemi

LC749880T by Onsemi

LC749880T by Onsemi is a consumer IC with 120 terminals in a square package. It operates b/w -30 to 70 °C, with power supplies of 1.8V and 3.3V. This CMOS technology IC is ideal for various consumer circuit applications due to its thin profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,103 parts In-Stock

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2,103

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Vyrian

USA . 1,105 parts In-Stock

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1,105

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 6,041 parts In-Stock

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6,041

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Problanco Electronics

Mexico . 5,642 parts In-Stock

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5,642

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Kulean Microsystems

USA . 5,419 parts In-Stock

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5,419

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UHIMA Technologies

Türkiye . 731 parts In-Stock

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731

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Corohmni

South Africa . 245 parts In-Stock

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245

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Corphita

USA . 195 parts In-Stock

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195

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TANS Electronics

Latvia . 7 parts In-Stock

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Overview

Discover the LC749880T by Onsemi, a top-quality consumer IC that offers exceptional performance and reliability. Manufactured by the trusted brand Onsemi, this product is designed to meet the highest standards in the industry. With applications in various electronic devices, this IC provides customers with unmatched value, benefits, and advantages. Experience superior functionality and efficiency with the LC749880T, making it the perfect choice for all your electronic needs. Trust Onsemi for cutting-edge technology and innovation that delivers unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost during production.

Package Shape: SQUARE

The square package shape enables efficient use of space on the circuit board, making it ideal for compact designs.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for flexibility in various applications, enhancing compatibility.

No. of Terminals: 120

The high number of terminals enables connectivity to multiple external components, increasing the versatility of the product.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can perform reliably even in demanding environments.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows the product to operate in a wide range of temperature conditions, enhancing its usability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Other Function Consumer ICs LC749880T attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

No. of Functions:

1

No. of Terminals:

120

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP120,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LC749880T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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