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LC74793

Onsemi

LC74793 by Onsemi

The Onsemi LC74793 is a consumer circuit IC with 24 terminals in an in-line package. Operating temperature ranges from -30 °C to 70°C. With a supply voltage range of 4.5V to 5.5V, it is suitable for various consumer electronic applications requiring compact and efficient circuitry.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

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Vyrian

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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Problanco Electronics

Mexico . 7,171 parts In-Stock

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Kulean Microsystems

USA . 4,758 parts In-Stock

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TANS Electronics

Latvia . 1,836 parts In-Stock

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Corphita

USA . 1,268 parts In-Stock

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SupplyDigital Components

Austria . 485 parts In-Stock

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Corohmni

South Africa . 485 parts In-Stock

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UHIMA Technologies

Türkiye . 233 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 100 parts In-Stock

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Kepictronics

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Overview

Experience unparalleled quality and reliability with the LC74793 by Onsemi. As a leader in the industry, Onsemi delivers cutting-edge solutions for consumer electronics with this innovative product. Ideal for a wide range of applications, the LC74793 offers unmatched performance and efficiency, making it the perfect choice for your next project. Trust Onsemi to provide you with the value, benefits, and advantages you need to succeed in today's competitive market. Choose the LC74793 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the IC, ensuring reliability and durability.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board, making it easy to integrate the IC into various electronic devices.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: -30 °C

The wide temperature range ensures that this IC can operate in cold environments without any issues, making it suitable for a variety of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC energy-efficient and reliable in noisy environments.

Width: 7.62 mm

The compact width of the IC allows for easy integration into small electronic devices, saving space on the circuit board.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement makes this IC compatible with a wide range of power sources, increasing its versatility.

Technical Specifications

Other Function Consumer ICs LC74793 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T24

Length:

21.2 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

3.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LC74793 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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