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LC74986NWF

Onsemi

LC74986NWF by Onsemi

LC74986NWF by Onsemi is a consumer IC with 144 terminals in a square flatpack package. Operating temperatures range from -30 °C to 70°C, suitable for various applications. It features power supplies of 2.5V and 3.3V, making it ideal for consumer circuit designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,879 parts In-Stock

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1,879

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Vyrian

USA . 1,612 parts In-Stock

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1,612

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 6,060 parts In-Stock

1+ parts

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6,060

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Kulean Microsystems

USA . 4,742 parts In-Stock

1+ parts

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1k+ parts

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4,742

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TANS Electronics

Latvia . 4,335 parts In-Stock

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4,335

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SupplyDigital Components

Austria . 3,528 parts In-Stock

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3,528

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Corphita

USA . 2,423 parts In-Stock

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2,423

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UHIMA Technologies

Türkiye . 904 parts In-Stock

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904

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Corohmni

South Africa . 120 parts In-Stock

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120

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Overview

Discover the unmatched quality and reliability of the LC74986NWF by Onsemi, a cutting-edge consumer IC that offers unparalleled performance and efficiency. With a focus on innovation and excellence, Onsemi ensures that each product meets the highest standards in the industry. This versatile IC is ideal for a wide range of applications, providing customers with a seamless and reliable solution for their electronic needs. Experience the value and benefits of the LC74986NWF, designed to exceed expectations and deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective, making it suitable for consumer electronics applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, reducing manufacturing time and costs.

Package Shape: SQUARE

The square package shape helps in optimizing PCB real estate, allowing for efficient use of space in a compact design.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) makes the product versatile and compatible with various systems and applications.

No. of Terminals: 144

The high number of terminals provides flexibility in interfacing with other components and peripherals, enhancing the product's functionality.

Package Style (Meter): FLATPACK

The flatpack package style offers a low-profile design, making it suitable for applications where space constraints are a consideration.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions, enhancing the product's durability.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows the product to operate efficiently in a wide range of temperature environments, increasing its versatility.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and ensures consistent electrical connections, contributing to the product's reliability.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it ideal for battery-powered consumer devices.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliability in solder joints, enhancing the product's overall robustness.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting of components on the PCB, enabling compact and efficient designs.

Technical Specifications

Other Function Consumer ICs LC74986NWF attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC74986NWF General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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