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LC74986NWV

Onsemi

LC74986NWV by Onsemi

The Onsemi LC74986NWV is a consumer circuit IC with 144 terminals, operating at temperatures from -30 °C to 70°C. It has power supplies of 1.8V and 3.3V, utilizing CMOS technology in a square-shaped plastic/epoxy package for surface mounting applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,934 parts In-Stock

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Vyrian

USA . 1,162 parts In-Stock

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1,162

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Problanco Electronics

Mexico . 3,188 parts In-Stock

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3,188

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Kulean Microsystems

USA . 2,790 parts In-Stock

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2,790

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TANS Electronics

Latvia . 842 parts In-Stock

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842

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UHIMA Technologies

Türkiye . 746 parts In-Stock

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746

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Corphita

USA . 630 parts In-Stock

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630

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Corohmni

South Africa . 307 parts In-Stock

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307

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SupplyDigital Components

Austria . 245 parts In-Stock

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Overview

Enhance your consumer electronics with the LC74986NWV by Onsemi, a high-quality and reliable consumer circuit IC that offers unmatched performance and efficiency. Manufactured by industry leader Onsemi, this versatile IC is perfect for a wide range of applications. With power supplies of 1.8V and 3.3V, this IC boasts 144 terminals and a temperature range from -30 °C to 70°C. The LC74986NWV is designed for convenience and ease of use, making it the ideal choice for your next project. Don't settle for anything less than the best – choose Onsemi for superior quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and heat resistance, making the product suitable for a wide range of operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Package Shape: SQUARE

Square package shape enables efficient use of board space and simplifies layout design in electronic devices.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for flexible integration into various systems and applications.

No. of Terminals: 144

Having 144 terminals provides ample connectivity options for complex circuit designs and functionalities.

Package Style (Meter): FLATPACK

Flatpack package style offers space-saving advantages and ensures better thermal performance compared to other package styles.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -30 °C

The ability to operate at temperatures as low as -30 °C makes the product suitable for a wide range of environmental conditions.

Terminal Position: QUAD

Quad terminal position provides a balanced layout for improved signal integrity and ease of soldering during assembly.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy and reliable soldering onto PCBs, ensuring secure electrical connections.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density packaging and precise signal routing in space-constrained electronic devices.

Technical Specifications

Other Function Consumer ICs LC74986NWV attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC74986NWV General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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