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LC74900

Onsemi

LC74900 by Onsemi

The Onsemi LC74900 is a consumer IC with 120 terminals in a square package. It operates b/w -40 °C to 85°C, suitable for industrial use. With a min supply voltage of 1.4V and max of 1.6V, it is ideal for various consumer circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 863 parts In-Stock

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Digiode

USA . 359 parts In-Stock

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359

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Kulean Microsystems

USA . 6,930 parts In-Stock

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6,930

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SupplyDigital Components

Austria . 5,694 parts In-Stock

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Problanco Electronics

Mexico . 4,021 parts In-Stock

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TANS Electronics

Latvia . 1,478 parts In-Stock

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Corphita

USA . 1,159 parts In-Stock

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UHIMA Technologies

Türkiye . 929 parts In-Stock

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929

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Corohmni

South Africa . 473 parts In-Stock

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Overview

Discover the LC74900 by Onsemi, a top-of-the-line consumer IC that offers unparalleled quality and reliability. Manufactured by industry leader Onsemi, this product boasts a durable package body material and surface mount design for easy installation. With a wide range of applications in various consumer circuits, the LC74900 delivers exceptional value and benefits to customers looking for high-performance solutions. Experience the advantages of advanced technology and innovative design with the LC74900 from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and can withstand various environmental conditions, making the product long-lasting.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square shape helps in maximizing space efficiency on the circuit board.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronic devices, ensuring compatibility and efficiency in consumer applications.

No. of Terminals: 120

Offers a high level of connectivity options, allowing for versatile usage and integration within a circuit.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The combination of flatpack, thin profile, and fine pitch design enables a compact and space-saving layout on the PCB.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Can operate efficiently in low-temperature environments, making it suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connection to the circuit board, reducing the risk of disconnection.

Maximum Seated Height: 1.2 mm

Low profile design helps in achieving a slim and compact form factor for the product.

Width: 14 mm

Moderate width size provides a good balance between space efficiency and easy handling during installation.

Minimum Supply Voltage (Vsup): 1.4 V

Low minimum supply voltage requirement allows for energy-efficient operation of the product.

Length: 14 mm

Compact length size makes it suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull-wing terminal form provides secure electrical connections and ease of soldering during assembly.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables high-density mounting on the PCB, optimizing space utilization.

Maximum Supply Voltage (Vsup): 1.6 V

Moderate maximum supply voltage ensures safe operation and protection of the product from overvoltage conditions.

Technical Specifications

Other Function Consumer ICs LC74900 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

No. of Functions:

1

No. of Terminals:

120

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

1.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LC74900 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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