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LB1940T-MPB-E

Onsemi

LB1940T-MPB-E by Onsemi

LB1940T-MPB-E by Onsemi is a Motion Control IC with 20 terminals, operating voltage of 1.9-7.5V, and output current of 0.4A. Ideal for stepper motor control applications due to its compact size, low supply current of 7mA, and bipolar technology for precise motion control.

Median Price

$1.260

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 70 parts In-Stock

1+ parts

-

100+ parts

$1.260

1k+ parts

$1.130

10k+ parts

$1.060

70

-

$1.260

$1.130

$1.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 900 parts In-Stock

1+ parts

$1.340

100+ parts

-

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900

$1.340

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Vyrian

USA . 4,597 parts In-Stock

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4,597

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Distributors (Availability)

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Corphita

USA . 741 parts In-Stock

1+ parts

$1.269

100+ parts

-

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-

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741

$1.269

-

-

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Corohmni

South Africa . 174 parts In-Stock

1+ parts

$1.410

100+ parts

-

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174

$1.410

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-

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Component Stockers USA

USA . 95 parts In-Stock

1+ parts

$1.440

100+ parts

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95

$1.440

-

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AZTECH Wire

Italy . 454 parts In-Stock

1+ parts

$9.410

100+ parts

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454

$9.410

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Problanco Electronics

Mexico . 5,335 parts In-Stock

1+ parts

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5,335

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TANS Electronics

Latvia . 3,730 parts In-Stock

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3,730

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SupplyDigital Components

Austria . 3,534 parts In-Stock

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3,534

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Kulean Microsystems

USA . 3,411 parts In-Stock

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3,411

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Microchip USA

USA . 157 parts In-Stock

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157

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UHIMA Technologies

Türkiye . 79 parts In-Stock

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79

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Overview

Upgrade your motion control systems with the LB1940T-MPB-E by Onsemi. Crafted with top-notch quality and precision, this small outline thin profile IC offers unparalleled performance in a variety of applications. From robotics to automation, this stepper motor controller provides reliable power supplies and optimal terminal positioning for seamless operation. Experience the value of efficiency and innovation with Onsemi's advanced technology, setting new standards for motion control ICs. Elevate your projects with the LB1940T-MPB-E and unlock endless possibilities in motion control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and reducing manufacturing complexity.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage ensures compatibility with many systems and power sources.

No. of Terminals: 20

Sufficient number of terminals for connectivity and control of various functions.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable performance in various environments.

Minimum Operating Temperature: -20 °C

Wide range of operating temperatures ensures functionality in both hot and cold conditions.

Technology: BIPOLAR

Bipolar technology offers precise control and efficient operation for motion control applications.

Technical Specifications

Motion Control ICs LB1940T-MPB-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH THE RANGE OF 1.9V TO 6.5V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e6

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3,5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

7 mA

Maximum Supply Voltage (Vsup):

7.5 V

Minimum Supply Voltage (Vsup):

1.9 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

LB1940T-MPB-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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