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LB1920

Onsemi

LB1920 by Onsemi

LB1920 by Onsemi is a Motion Control IC with 24V supply voltage. It has 28 terminals in an IN-LINE, SHRINK PITCH package style. Operating temperature ranges from -20 to 80 °C, making it ideal for commercial extended applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,043 parts In-Stock

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Vyrian

USA . 776 parts In-Stock

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TANS Electronics

Latvia . 7,506 parts In-Stock

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SupplyDigital Components

Austria . 5,522 parts In-Stock

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Kulean Microsystems

USA . 3,016 parts In-Stock

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Assy Fe

Spain . 2,869 parts In-Stock

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Problanco Electronics

Mexico . 2,352 parts In-Stock

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Corphita

USA . 1,397 parts In-Stock

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UHIMA Technologies

Türkiye . 408 parts In-Stock

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Corohmni

South Africa . 303 parts In-Stock

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Overview

Unlock the power of precise motion control with the LB1920 by Onsemi. Known for their top-notch quality and expertise in manufacturing, Onsemi delivers a solution that exceeds expectations. Ideal for a wide range of applications, this motion control IC offers unparalleled value and benefits to customers. With a nominal supply voltage of 24V and a maximum operating temperature of 80 °C, the LB1920 ensures reliable performance in any environment. Experience seamless operation and enhanced efficiency with the LB1920 - the perfect choice for all your motion control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the motion control IC, making it a reliable choice for various applications.

Nominal Supply Voltage (Vsup): 24 V

The 24V supply voltage allows for compatibility with a wide range of systems and equipment, providing flexibility in integration and usage.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80 °C, this motion control IC can withstand high temperature environments, ensuring its performance and longevity.

Technology: BIPOLAR

The use of bipolar technology in this motion control IC offers high precision and accuracy in controlling motion, making it suitable for applications where precise movements are required.

Terminal Pitch: 1.78 mm

The small terminal pitch of 1.78mm allows for compact design and space-saving installation of the motion control IC, ideal for applications with limited space constraints.

Technical Specifications

Motion Control ICs LB1920 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP28,.5

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

50 mA

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LB1920 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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