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LB1946-E

Onsemi

LB1946-E by Onsemi

LB1946-E by Onsemi is a Motion Control IC with 28 terminals, operating at -20 to 85°C. It features power supplies of 3.3/5,45V and a max supply current of 48.5mA. Ideal for applications requiring bipolar technology in an in-line package style with tin/bismuth terminal finish.

Median Price

$3.038

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 636 parts In-Stock

1+ parts

-

100+ parts

$2.720

1k+ parts

$2.430

10k+ parts

$2.290

636

-

$2.720

$2.430

$2.290

DigiKey

USA . 636 parts In-Stock

1+ parts

-

100+ parts

$3.570

1k+ parts

-

10k+ parts

-

636

-

$3.570

-

-

Verical

USA . 636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.038

10k+ parts

$2.862

636

-

-

$3.038

$2.862

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,242 parts In-Stock

1+ parts

$2.878

100+ parts

-

1k+ parts

-

10k+ parts

-

2,242

$2.878

-

-

-

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$2.965

100+ parts

-

1k+ parts

-

10k+ parts

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32

$2.965

-

-

-

Chip Stock

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

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15,000

-

-

-

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Vyrian

USA . 3,313 parts In-Stock

1+ parts

-

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-

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3,313

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 221 parts In-Stock

1+ parts

$2.270

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$2.270

-

-

-

Corohmni

South Africa . 204 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

-

10k+ parts

-

204

$2.670

-

-

-

Corphita

USA . 780 parts In-Stock

1+ parts

$2.727

100+ parts

-

1k+ parts

-

10k+ parts

-

780

$2.727

-

-

-

Argo Parts USA

USA . 1,714 parts In-Stock

1+ parts

$2.965

100+ parts

-

1k+ parts

-

10k+ parts

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1,714

$2.965

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$2.965

100+ parts

-

1k+ parts

$2.817

10k+ parts

$2.757

100

$2.965

-

$2.817

$2.757

AZTECH Wire

Italy . 999 parts In-Stock

1+ parts

$12.300

100+ parts

-

1k+ parts

-

10k+ parts

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999

$12.300

-

-

-

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$14.206

100+ parts

$12.927

1k+ parts

$11.649

10k+ parts

-

150

$14.206

$12.927

$11.649

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SupplyDigital Components

Austria . 4,990 parts In-Stock

1+ parts

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100+ parts

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4,990

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TANS Electronics

Latvia . 4,034 parts In-Stock

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4,034

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-

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Problanco Electronics

Mexico . 3,847 parts In-Stock

1+ parts

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3,847

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Kulean Microsystems

USA . 2,585 parts In-Stock

1+ parts

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2,585

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UHIMA Technologies

Türkiye . 675 parts In-Stock

1+ parts

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100+ parts

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675

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-

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Continental Prestige Electronics

USA . 636 parts In-Stock

1+ parts

-

100+ parts

$2.580

1k+ parts

-

10k+ parts

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636

-

$2.580

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-

Microchip USA

USA . 325 parts In-Stock

1+ parts

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100+ parts

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325

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Perfect Parts

USA . 152 parts In-Stock

1+ parts

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100+ parts

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152

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Overview

Enhance your motion control applications with the LB1946-E by Onsemi, a cutting-edge solution for precise and efficient control. With a reputation for top-quality manufacturing, Onsemi delivers reliability and performance that you can trust. Whether you're looking to optimize robotics, automation, or industrial equipment, this versatile IC offers unparalleled value and benefits. Experience seamless integration, superior power supplies, and advanced technology in a compact and durable package. Elevate your projects with the LB1946-E and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and protects the internal components of the Motion Control ICs from external elements, making it a reliable choice for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into electronic systems and provides a compact footprint, saving space and allowing for flexible mounting options.

Power Supplies (V): 3.3/5,45

The multiple power supply options of 3.3V, 5V, and 45V offer versatility in voltage requirements, making these Motion Control ICs suitable for a wide range of applications.

No. of Terminals: 28

With a high number of terminals, these Motion Control ICs offer enhanced connectivity options and functionality, making them suitable for complex control systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation even in challenging environments, making these ICs ideal for industrial applications.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20°C enables these Motion Control ICs to function effectively in cold environments, expanding their usability in various conditions.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability and stability in connectivity for these ICs.

Maximum Supply Current (Isup): 48.5 mA

The high maximum supply current of 48.5 mA allows these Motion Control ICs to drive multiple components and motors simultaneously, making them suitable for demanding control applications.

Technology: BIPOLAR

The bipolar technology used in these ICs offers precise control and high accuracy in motion applications, making them a preferred choice for robotics, automation, and other control systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easy and secure soldering onto circuit boards, enhancing the reliability and durability of the connections for these Motion Control ICs.

Terminal Pitch: 1.78 mm

The small terminal pitch of 1.78 mm allows for compact PCB design and efficient use of space, making these ICs suitable for applications where size constraints are a concern.

Technical Specifications

Motion Control ICs LB1946-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP28,.5

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3.3/5,45

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

48.5 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Trade Compliance

LB1946-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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