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LB1930MC

Onsemi

LB1930MC by Onsemi

LB1930MC by Onsemi is a Motion Control IC with 10 terminals, operating voltage range of 2.2V to 10.8V, and max output current of 1A. It is designed for BRUSH DC MOTOR CONTROL applications, featuring a small outline package with gull wing terminals suitable for surface mount assembly in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,696 parts In-Stock

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Digiode

USA . 608 parts In-Stock

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608

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Problanco Electronics

Mexico . 6,486 parts In-Stock

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6,486

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TANS Electronics

Latvia . 4,637 parts In-Stock

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Kulean Microsystems

USA . 3,682 parts In-Stock

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SupplyDigital Components

Austria . 1,673 parts In-Stock

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Corphita

USA . 1,144 parts In-Stock

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UHIMA Technologies

Türkiye . 946 parts In-Stock

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946

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Corohmni

South Africa . 388 parts In-Stock

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Perfect Parts

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Overview

Elevate your motion control systems with the LB1930MC by Onsemi, a top-tier manufacturer known for delivering quality ICs. Designed for brush DC motor control applications, this small outline, shrink pitch package offers customers high performance and reliability. With a wide supply voltage range of 2.2V to 10.8V and a maximum output current of 1A, this motion control IC provides flexibility and efficiency for your projects. Say goodbye to technical headaches and hello to seamless operation with the LB1930MC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the Motion Control IC, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy installation and integration into circuit boards, making it suitable for modern electronic devices that require compact components.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the circuit board, making it ideal for applications where size is a concern.

Nominal Supply Voltage (Vsup): 3 V

Optimal supply voltage ensures stable and consistent performance of the Motion Control IC, preventing damage from overvoltage.

No. of Terminals: 10

Sufficient number of terminals for connecting to other components and interfaces, providing flexibility in the circuit design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the Motion Control IC to function effectively in various environments without overheating.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures the Motion Control IC can operate in cold conditions without malfunctioning.

Maximum Output Current: 1 A

Capable of delivering a maximum output current of 1A, making it suitable for driving small to medium-sized motors efficiently.

Technical Specifications

Motion Control ICs LB1930MC attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G10

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

10.8 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

LB1930MC Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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