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LB1930M

Onsemi

LB1930M by Onsemi

LB1930M by Onsemi is a Motion Control IC with 10 terminals, operating voltage of 2.2-10.8V, and max output current of 1A. Ideal for brush DC motor control applications due to its compact size (5x4.4mm) and temp range (-30 to 85 °C). Features gull wing terminals and low profile package design for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,353 parts In-Stock

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Vyrian

USA . 1,881 parts In-Stock

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Kulean Microsystems

USA . 8,203 parts In-Stock

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TANS Electronics

Latvia . 5,018 parts In-Stock

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SupplyDigital Components

Austria . 3,901 parts In-Stock

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Problanco Electronics

Mexico . 3,839 parts In-Stock

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Corphita

USA . 1,053 parts In-Stock

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UHIMA Technologies

Türkiye . 662 parts In-Stock

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Corohmni

South Africa . 273 parts In-Stock

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Kepictronics

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Overview

Enhance your motion control applications with the LB1930M by Onsemi, a high-quality and reliable solution for driving brush DC motors. Onsemi is known for its cutting-edge technology and innovative designs, ensuring top-notch performance in every product they offer. With a nominal supply voltage of 3V and maximum output current of 1A, this compact and versatile IC provides exceptional value and efficiency. Say goodbye to limitations and elevate your projects to new heights with the LB1930M - the ultimate choice for motion control solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are commonly used in electronic components as they are durable and provide good protection for the inner components of the product.

Surface Mount: YES

Surface mount components are easier to assemble on PCBs, making the product more convenient for manufacturers during the assembly process.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3V makes this product compatible with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high temperatures without compromising performance or reliability.

Maximum Output Current: 1 A

The high maximum output current of 1A allows this product to drive motors and other devices with higher power requirements.

Technical Specifications

Motion Control ICs LB1930M attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G10

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

31 mA

Maximum Supply Voltage (Vsup):

10.8 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LB1930M Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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