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LB1928

Onsemi

LB1928 by Onsemi

LB1928 by Onsemi is a Motion Control IC with 28 terminals, operating at 24V. It features a max output current of 3.1A and supports a supply voltage range from 9.5V to 28V. Ideal for applications requiring Brushless DC Motor control in commercial extended temperature environments.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,144 parts In-Stock

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Vyrian

USA . 1,179 parts In-Stock

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Kulean Microsystems

USA . 7,633 parts In-Stock

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SupplyDigital Components

Austria . 5,478 parts In-Stock

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Problanco Electronics

Mexico . 4,996 parts In-Stock

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TANS Electronics

Latvia . 3,161 parts In-Stock

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UHIMA Technologies

Türkiye . 870 parts In-Stock

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Corohmni

South Africa . 303 parts In-Stock

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Corphita

USA . 179 parts In-Stock

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Overview

Unlock the power of precise motion control with the LB1928 by Onsemi. Crafted with superior quality and expertise, this brushless DC motor controller offers unmatched reliability and performance for a wide range of applications. From robotics to industrial automation, this innovative IC provides seamless operation and efficiency. Experience the value of smooth, accurate motion with the LB1928 - where quality meets excellence. Elevate your projects with the best in motion control technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material provides durability and protection to the IC, making it suitable for industrial applications.

Nominal Supply Voltage (Vsup): 24 V

Operates efficiently at a standard 24V supply voltage, making it compatible with common power sources.

Maximum Operating Temperature: 80 °C

Capable of operating in high-temperature environments, ensuring reliable performance under challenging conditions.

Technology: BIPOLAR

Utilizes bipolar technology for efficient control and precise handling of motion, enhancing overall performance.

Technical Specifications

Motion Control ICs LB1928 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T28

Length:

27 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

3.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP28,.5

Package Shape:

Package Style (Meter):

IN-LINE, HEAT SINK/SLUG

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

4 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

9.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Width (mm):

12.7 mm

Trade Compliance

LB1928 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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