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FSBB15CH60D

Onsemi

FSBB15CH60D by Onsemi

FSBB15CH60D by Onsemi is a Motion Control IC with 27 terminals, operating b/w -40 to 125°C. It features a max output current of 30A and supports AC motor control applications. With a package size of 44x27mm and automotive temperature grade, it's ideal for high-power motion control systems.

Median Price

$23.390

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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EBV Elektronik

Germany . 120 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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$23.390

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$23.390

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Vyrian

USA . 6,640 parts In-Stock

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Digiode

USA . 1,146 parts In-Stock

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Sensible Micro Corp

USA . 714 parts In-Stock

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714

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Chip Stock

USA . 455 parts In-Stock

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455

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 264 parts In-Stock

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$14.382

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264

$14.382

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AZTECH Wire

Italy . 210 parts In-Stock

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$15.199

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210

$15.199

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Ampacity Inc.

Singapore . 90 parts In-Stock

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$18.670

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90

$18.670

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Semicontronic

India . 90 parts In-Stock

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$18.670

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$18.203

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$18.110

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90

$18.670

$18.203

$18.110

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Continental Prestige Electronics

USA . 5,232 parts In-Stock

1+ parts

$20.379

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$19.971

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$20.379

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$19.971

Corohmni

South Africa . 199 parts In-Stock

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$21.960

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Bastille Electronics

Australia . 800 parts In-Stock

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$23.390

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$22.220

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$20.817

800

$23.390

$22.220

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$20.817

Microchip USA

USA . 5,107 parts In-Stock

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$63.940

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SupplyDigital Components

Austria . 7,188 parts In-Stock

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TANS Electronics

Latvia . 7,131 parts In-Stock

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Problanco Electronics

Mexico . 5,567 parts In-Stock

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Kulean Microsystems

USA . 4,519 parts In-Stock

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Supply Digital

USA . 2,642 parts In-Stock

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RC Electronics

USA . 2,422 parts In-Stock

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$21.140

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$19.930

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$19.530

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$19.530

Kepictronics

USA . 1,500 parts In-Stock

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Corphita

USA . 1,284 parts In-Stock

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GreenTree Electronics

Israel . 478 parts In-Stock

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UHIMA Technologies

Türkiye . 471 parts In-Stock

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471

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Perfect Parts

USA . 464 parts In-Stock

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Argo Parts USA

USA . 253 parts In-Stock

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Overview

Enhance your motion control systems with the reliable FSBB15CH60D by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and cutting-edge technology in their products. The FSBB15CH60D falls under the category of Motion Control ICs, offering a wide range of applications in the automotive industry. With a maximum output current of 30A and a temperature grade suitable for automotive use, this AC motor controller provides exceptional value and performance for your projects. Upgrade your systems today with the FSBB15CH60D and experience the benefits of superior quality and efficiency.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into various designs and applications.

Nominal Supply Voltage (Vsup): 15 V

The nominal supply voltage of 15V provides a stable power source for the motion control IC, ensuring reliable performance.

No. of Terminals: 27

With 27 terminals, this motion control IC offers flexibility in connectivity and control options.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this IC can withstand high-temperature environments, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures that the IC can also function reliably in cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin terminal finish provides good solderability and ensures reliable connections for the IC.

Terminal Position: DUAL

Dual terminal position offers redundancy and improves reliability of the connections.

Maximum Seated Height: 7.5 mm

Low maximum seated height of 7.5mm allows for compact design and efficient use of space in a system.

Width (mm): 27 mm

With a width of 27mm, this IC can fit into a wide range of applications without taking up too much space.

Other IC type: AC MOTOR CONTROLLER

Being an AC motor controller, this IC can efficiently control AC motors, making it suitable for a variety of motion control applications.

Minimum Supply Voltage (Vsup): 14 V

With a minimum supply voltage of 14V, this IC can operate efficiently even at lower voltage levels.

Length: 44 mm

A length of 44mm provides a good balance between compact size and functionality for this motion control IC.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets the stringent temperature and reliability requirements of the automotive industry.

Maximum Output Current: 30 A

With a maximum output current of 30A, this IC can handle high current loads, making it suitable for driving motors and other high-power devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong mechanical connections and ease of soldering for the IC.

Maximum Supply Voltage (Vsup): 16.5 V

With a maximum supply voltage of 16.5V, this IC can handle higher voltage levels without any issues, providing versatility in the applications it can be used for.

Technical Specifications

Motion Control ICs FSBB15CH60D attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T27

JESD-609 Code:

e3

Length:

44 mm

No. of Functions:

1

No. of Terminals:

27

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

30 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

7.5 mm

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

27 mm

Trade Compliance

FSBB15CH60D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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