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LA4581MB

Onsemi

LA4581MB by Onsemi

LA4581MB by Onsemi is a 24-terminal audio & video amplifier with a power supply of 3V. It operates b/w -20 °C to 70°C, making it suitable for commercial applications. This bipolar technology chip has a max supply current of 27mA and comes in a small outline package shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,471 parts In-Stock

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Digiode

USA . 702 parts In-Stock

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702

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TANS Electronics

Latvia . 7,822 parts In-Stock

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Problanco Electronics

Mexico . 3,615 parts In-Stock

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SupplyDigital Components

Austria . 2,748 parts In-Stock

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Kulean Microsystems

USA . 1,942 parts In-Stock

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Corphita

USA . 1,442 parts In-Stock

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Corohmni

South Africa . 497 parts In-Stock

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UHIMA Technologies

Türkiye . 433 parts In-Stock

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Overview

Enhance your audio and video experience with the LA4581MB by Onsemi. Known for their high-quality products, Onsemi has crafted this audio amplifier to deliver unmatched performance and reliability. Whether you're upgrading your home sound system or enhancing your car's audio setup, the LA4581MB offers crystal-clear sound and powerful amplification. With its small outline and surface mount capabilities, this amplifier is versatile and easy to install. Trust Onsemi to provide innovative solutions that elevate your audio and video experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for portable or stationary applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic circuit boards.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, saving space in electronic devices.

Power Supplies (V): 3

Operating at a low voltage of 3V makes the product energy-efficient and suitable for battery-powered applications.

No. of Terminals: 24

Having 24 terminals allows for multiple connection options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style make the product ideal for compact and densely populated circuit boards.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70 °C, the product can withstand elevated temperatures and operate reliably in various environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C ensures the product can function effectively in cold conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures reliable connections for signal transmission.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the product meets standard operating temperature requirements for commercial applications.

Technology: BIPOLAR

Bipolar technology offers excellent audio performance and efficiency in amplifying signals accurately.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connections, enhancing the product's reliability.

Maximum Supply Current: 27 mA

Capable of handling a maximum supply current of 27mA ensures stable power delivery and optimal performance.

Terminal Pitch: 1 mm

The 1mm terminal pitch provides precise spacing for terminals, enabling efficient electrical connections and signal transmission.

Technical Specifications

Audio & Video Amplifiers LA4581MB attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.3,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

27 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LA4581MB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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