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LA4535M

Onsemi

LA4535M by Onsemi

LA4535M by Onsemi is a 2-function audio amplifier IC in a small outline package. With 10 terminals and surface mount capability, it operates b/w -20 °C to 70°C. Ideal for commercial-grade applications requiring low supply current of 6 mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,315 parts In-Stock

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Digiode

USA . 1,492 parts In-Stock

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LittleDiode

UK . 10 parts In-Stock

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10

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SupplyDigital Components

Austria . 6,346 parts In-Stock

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Problanco Electronics

Mexico . 4,202 parts In-Stock

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Kulean Microsystems

USA . 3,831 parts In-Stock

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TANS Electronics

Latvia . 920 parts In-Stock

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Corphita

USA . 624 parts In-Stock

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UHIMA Technologies

Türkiye . 617 parts In-Stock

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Corohmni

South Africa . 420 parts In-Stock

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Overview

Elevate your audio and video experience with the LA4535M by Onsemi. This top-quality audio amplifier offers unmatched performance and reliability, thanks to Onsemi's reputation for excellence in manufacturing. Perfect for a wide range of applications, this versatile product provides clear, crisp sound amplification with ease. Say goodbye to subpar audio quality and hello to immersive sound experiences with the LA4535M. Upgrade your audio setup today and enjoy the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and can withstand various environmental conditions, making the product long-lasting.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into compact electronic devices.

No. of Functions: 2

Having 2 functions increases the versatility of the amplifier, allowing for more customization and improved performance.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient use of space, making it ideal for small or compact audio/video devices.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output.

No. of Terminals: 10

Having 10 terminals provides more connectivity options, allowing for greater flexibility in system design and setup.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch design enable the amplifier to be used in space-constrained applications without compromising performance.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures the amplifier can operate efficiently even in elevated temperatures.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows the amplifier to function reliably in colder environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves reliability of connections.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the amplifier is suitable for standard commercial applications.

Technology: BIPOLAR

Bipolar technology offers high amplification gain and low distortion, resulting in superior audio performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and installation, contributing to faster production processes.

Maximum Supply Current: 6 mA

Low maximum supply current consumption helps in energy efficiency and prolongs battery life in portable devices.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high-density mounting and space-saving layout, especially beneficial in compact electronics.

Technical Specifications

Audio & Video Amplifiers LA4535M attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G10

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LA4535M General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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