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LA4535MC-BH

Onsemi

LA4535MC-BH by Onsemi

LA4535MC-BH by Onsemi is an audio amplifier IC with 10 terminals, operating temperature range of -25 to 70 °C. It has a supply voltage of 1.5V and max current draw of 6mA. This bipolar technology chip is surface mountable and suitable for audio and video amplification applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,427 parts In-Stock

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Flip Electronics

USA . 2,200 parts In-Stock

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Digiode

USA . 953 parts In-Stock

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953

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AZTECH Wire

Italy . 841 parts In-Stock

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$20.140

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841

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Component Stockers USA

USA . 471 parts In-Stock

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$99.990

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471

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Perfect Parts

USA . 11,585 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,865 parts In-Stock

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TANS Electronics

Latvia . 5,675 parts In-Stock

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Microchip USA

USA . 4,478 parts In-Stock

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Problanco Electronics

Mexico . 4,202 parts In-Stock

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Kulean Microsystems

USA . 3,442 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 2,665 parts In-Stock

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Corphita

USA . 2,111 parts In-Stock

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GreenTree Electronics

Israel . 2,048 parts In-Stock

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UHIMA Technologies

Türkiye . 369 parts In-Stock

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Corohmni

South Africa . 332 parts In-Stock

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Overview

Upgrade your audio experience with the LA4535MC-BH by Onsemi. Manufactured with top-quality materials and cutting-edge technology, this audio amplifier delivers crystal-clear sound and powerful performance. Perfect for a wide range of applications in the audio and video industry, this product offers unmatched value and benefits to customers. Transform your listening experience today with the LA4535MC-BH by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the amplifier, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes the installation process easier and more efficient.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output.

Power Supplies (V): 1.5

Low power consumption of 1.5V makes it energy-efficient.

Maximum Operating Temperature: 70 °C

Operates efficiently even at high temperatures, ensuring stable performance in various environments.

Minimum Operating Temperature: -25 °C

Capable of functioning in low temperature conditions, making it suitable for a wide range of applications.

Technology: BIPOLAR

Bipolar technology offers high-fidelity audio amplification, delivering clear and crisp sound.

Technical Specifications

Audio & Video Amplifiers LA4535MC-BH attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LA4535MC-BH General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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