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LA4537M-TE-L-E

Onsemi

LA4537M-TE-L-E by Onsemi

LA4537M-TE-L-E by Onsemi is an audio amplifier IC with 10 terminals, operating from -20 °C to 70°C. It has a power supply range of 0.9V to 4V and a max supply current of 6mA. This small outline package is ideal for audio and video amplification applications in commercial-grade electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,637 parts In-Stock

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3,637

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Digiode

USA . 1,295 parts In-Stock

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1,295

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AZTECH Wire

Italy . 1,114 parts In-Stock

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$11.230

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Component Stockers USA

USA . 432 parts In-Stock

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$99.990

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432

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QUARKTWIN TECHNOLOGY LTD

USA . 28,073 parts In-Stock

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TANS Electronics

Latvia . 6,059 parts In-Stock

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Microchip USA

USA . 4,672 parts In-Stock

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Problanco Electronics

Mexico . 4,002 parts In-Stock

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SupplyDigital Components

Austria . 3,188 parts In-Stock

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Kulean Microsystems

USA . 2,744 parts In-Stock

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UHIMA Technologies

Türkiye . 758 parts In-Stock

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Corphita

USA . 430 parts In-Stock

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Corohmni

South Africa . 244 parts In-Stock

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Overview

Upgrade your audio and video experience with the LA4537M-TE-L-E by Onsemi. This high-quality audio amplifier offers crystal-clear sound and seamless integration into any system. With a compact design and easy surface mount installation, this product is perfect for a wide range of applications. Trust in Onsemi's reputation for excellence and innovation in the industry. Elevate your audio and video projects with the LA4537M-TE-L-E and enjoy the benefits of superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the amplifier lightweight and durable, making it easy to handle and long-lasting.

Surface Mount: YES

The surface mount feature allows for easy integration into circuit boards, making installation and assembly of the amplifier efficient and hassle-free.

Package Shape: RECTANGULAR

The rectangular package shape is a common and practical design, making the amplifier easy to fit into compact spaces within electronic devices.

General IC Type: AUDIO AMPLIFIER

Being an audio amplifier, this product is specifically designed to enhance sound quality and performance, making it an ideal choice for audio applications.

Power Supplies (V): 0.9/4

With a wide range of power supply options, this amplifier can be used in various voltage settings, allowing for flexibility in different electronic setups.

No. of Terminals: 10

Having 10 terminals provides multiple connection points, enabling the amplifier to interface with other components and devices effectively.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design of the package style contribute to space-saving and efficient circuit board layouts, optimizing overall system performance.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance under varying temperature conditions, making the amplifier suitable for different environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C indicates the amplifier's ability to function in cold environments, expanding its usability in diverse settings.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides corrosion resistance and good electrical conductivity, ensuring stable connections and enhancing the overall reliability of the amplifier.

Terminal Position: DUAL

Having dual terminal positions facilitates easy routing and connection of wires, simplifying the installation process and ensuring secure electrical contacts.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the amplifier meets industry standards for performance and reliability in typical commercial applications.

Technology: BIPOLAR

The bipolar technology used in this amplifier offers high precision and low noise performance, delivering clear and accurate audio output for enhanced sound quality.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure attachment to the circuit board, enhancing the durability and stability of the amplifier during operation.

Maximum Supply Current: 6 mA

With a maximum supply current of 6 mA, this amplifier is energy-efficient and consumes low power, making it suitable for battery-powered devices and applications that require low power consumption.

Terminal Pitch: 1 mm

The 1 mm terminal pitch allows for precise and compact assembly of the amplifier on a circuit board, enabling a neat layout and efficient use of space in electronic devices.

Technical Specifications

Audio & Video Amplifiers LA4537M-TE-L-E attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

0.9/4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LA4537M-TE-L-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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