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LA4537MC-BH

Onsemi

LA4537MC-BH by Onsemi

LA4537MC-BH by Onsemi is a 2-function audio amplifier with a power supply of 1.5V, suitable for commercial-grade applications. It features a small outline package style with 10 terminals and operates b/w -20 °C to 70°C temperature range. This surface-mount IC has a max supply current of 6mA, making it ideal for audio and video amplification in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,041 parts In-Stock

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2,041

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Digiode

USA . 350 parts In-Stock

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350

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Distributors (Availability)

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AZTECH Wire

Italy . 981 parts In-Stock

1+ parts

$14.570

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981

$14.570

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QUARKTWIN TECHNOLOGY LTD

USA . 8,931 parts In-Stock

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Microchip USA

USA . 5,270 parts In-Stock

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5,270

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kulean Microsystems

USA . 3,306 parts In-Stock

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3,306

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SupplyDigital Components

Austria . 2,908 parts In-Stock

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2,908

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TANS Electronics

Latvia . 1,102 parts In-Stock

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Problanco Electronics

Mexico . 615 parts In-Stock

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UHIMA Technologies

Türkiye . 399 parts In-Stock

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399

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Corphita

USA . 201 parts In-Stock

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Corohmni

South Africa . 94 parts In-Stock

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Overview

Enhance your audio and video projects with the LA4537MC-BH by Onsemi. Manufactured with top-notch quality and expertise, this audio amplifier offers exceptional performance and reliability. Whether you're working on sound systems, home entertainment devices, or automotive applications, this product provides clear and powerful sound output. With its compact design and easy installation, customers can enjoy seamless integration and enhanced audio experience. Upgrade your projects today with the LA4537MC-BH and take your audio and video amplification to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand everyday wear and tear.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the amplifier on circuit boards, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions in one device simplifies the design and implementation process, making this amplifier a versatile and cost-effective choice.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and space-efficient design, ideal for applications where space is limited.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio amplification, this amplifier ensures high-quality sound output and performance for audio applications.

Power Supplies (V): 1.5

With a low power supply requirement of 1.5V, this amplifier is energy-efficient and suitable for battery-powered devices.

No. of Terminals: 10

Having 10 terminals allows for connectivity to various components and peripherals, increasing the flexibility and compatibility of the amplifier.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style minimizes the footprint of the amplifier, making it suitable for compact electronic devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures the amplifier can function reliably in a range of environmental conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C allows the amplifier to operate in cold environments without performance degradation.

Terminal Finish: TIN

The use of TIN terminal finish provides a reliable and corrosion-resistant connection, ensuring long-term performance and durability.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connections, providing stability and reliability in the amplifier's operation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C makes the amplifier suitable for reflow soldering processes, ensuring efficient and reliable assembly.

Technology: BIPOLAR

The bipolar technology used in this amplifier provides high-quality audio amplification performance with low distortion and noise levels.

Maximum Supply Current: 6 mA

With a maximum supply current of 6 mA, this amplifier is energy-efficient and suitable for low-power applications, extending battery life.

Terminal Pitch: 1 mm

The 1mm terminal pitch provides precise and secure connections, ensuring reliable performance and durability of the amplifier.

Technical Specifications

Audio & Video Amplifiers LA4537MC-BH attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LA4537MC-BH General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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