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LA4525

Onsemi

LA4525 by Onsemi

LA4525 by Onsemi is an audio amplifier IC with 2 functions, operating b/w -25 °C to 70°C. It has a max supply current of 30mA and comes in an 8-terminal rectangular package style. Ideal for audio and video applications requiring bipolar technology in plastic/epoxy material.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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4 Star Electronics, Inc.

USA . 11,154 parts In-Stock

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Q Components

USA . 3,100 parts In-Stock

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Vyrian

USA . 690 parts In-Stock

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Cyclops Electronics Ltd

UK . 324 parts In-Stock

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Digiode

USA . 195 parts In-Stock

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Electronic Expediters

USA . 125 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 9 parts In-Stock

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LittleDiode

UK . 7 parts In-Stock

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TANS Electronics

Latvia . 6,596 parts In-Stock

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SupplyDigital Components

Austria . 5,798 parts In-Stock

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Kulean Microsystems

USA . 4,531 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 1,819 parts In-Stock

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Corphita

USA . 1,076 parts In-Stock

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UHIMA Technologies

Türkiye . 894 parts In-Stock

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Perfect Parts

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Metaverse IC Inc.

Canada . 618 parts In-Stock

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Corohmni

South Africa . 183 parts In-Stock

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Overview

Enhance your audio and video experiences with the LA4525 by Onsemi. Known for their high-quality products, Onsemi brings you a top-notch audio amplifier that offers clear sound and seamless performance. Whether you're setting up a home theater system or upgrading your car audio, this versatile amplifier has got you covered. With its innovative technology and reliable design, the LA4525 delivers exceptional value and benefits to customers looking to elevate their audio and video setups. Trust Onsemi to provide you with the best in audio amplification - get your hands on the LA4525 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body is durable and lightweight, making the amplifier easy to handle and resistant to damage.

No. of Functions: 2

Having 2 functions allows for versatility in usage and compatibility with different audio systems, providing more options for customization.

Package Shape: RECTANGULAR

The rectangular package shape makes the amplifier compact and easy to integrate into various audio setups, saving space and reducing clutter.

No. of Terminals: 8

With 8 terminals, this amplifier can support multiple connections and provide a stable and reliable signal transmission for enhanced audio performance.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70 °C ensures that the amplifier can function efficiently even under high temperature conditions, improving its reliability and longevity.

Minimum Operating Temperature: -25 °C

The minimum operating temperature of -25 °C allows the amplifier to be used in a wide range of environments, making it suitable for various applications and settings.

Technology: BIPOLAR

The bipolar technology used in this amplifier offers high-quality audio performance, precise signal amplification, and low noise output, resulting in clear and distortion-free sound.

Maximum Supply Current: 30 mA

With a maximum supply current of 30 mA, this amplifier can deliver sufficient power to drive audio signals with precision and accuracy, ensuring optimal sound quality.

Technical Specifications

Audio & Video Amplifiers LA4525 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T8

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

30 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

LA4525 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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