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LA4537M

Onsemi

LA4537M by Onsemi

LA4537M by Onsemi is a 10-terminal audio amplifier IC with 2 functions. It operates b/w -20 °C to 70°C, suitable for commercial applications. This bipolar technology chip has a max supply current of 6 mA and is surface mountable, ideal for audio and video amplification in compact devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,426 parts In-Stock

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Vyrian

USA . 910 parts In-Stock

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910

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SupplyDigital Components

Austria . 7,443 parts In-Stock

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7,443

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TANS Electronics

Latvia . 5,619 parts In-Stock

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Kulean Microsystems

USA . 2,095 parts In-Stock

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Corphita

USA . 2,028 parts In-Stock

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Problanco Electronics

Mexico . 1,787 parts In-Stock

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Corohmni

South Africa . 330 parts In-Stock

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UHIMA Technologies

Türkiye . 41 parts In-Stock

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Overview

Enhance your audio and video experience with the LA4537M by Onsemi. Crafted with precision and expertise, Onsemi is known for producing high-quality audio amplifiers that deliver exceptional performance. The LA4537M, a versatile amplifier with two functions, is perfect for a wide range of applications. Whether you're upgrading your home entertainment system or enhancing the sound quality of your devices, this amplifier offers superior value and benefits. Trust in Onsemi to provide you with top-notch products that elevate your audio and video experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and lightweight construction, making it easy to handle and install.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving space and reducing the need for additional components.

No. of Functions: 2

Having 2 functions in one device provides versatility and cost-effectiveness, as it eliminates the need for multiple separate components.

General IC Type: AUDIO AMPLIFIER

Being an audio amplifier ensures high-quality sound output and efficient amplification of audio signals, making it ideal for audio systems and applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C allows for reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C ensures the amplifier can function effectively in cold environments.

Technology: BIPOLAR

The use of bipolar technology offers high signal fidelity and efficiency, providing clear and powerful audio amplification.

Technical Specifications

Audio & Video Amplifiers LA4537M attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G10

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LA4537M General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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