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FDMC8360LET40

Onsemi

FDMC8360LET40 by Onsemi

FDMC8360LET40 by Onsemi is an N-CHANNEL Power FET with 40V DS Breakdown Voltage and 658A Pulsed Drain Current. Ideal for SWITCHING applications, it features a built-in diode, 0.0021 ohm Drain-Source Resistance, and operates in ENHANCEMENT MODE.

Median Price

$1.161

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 200 parts In-Stock

1+ parts

$0.548

100+ parts

$0.521

1k+ parts

$0.521

10k+ parts

-

200

$0.548

$0.521

$0.521

-

DigiKey

USA . 18,000 parts In-Stock

1+ parts

$2.370

100+ parts

$1.029

1k+ parts

$0.754

10k+ parts

-

18,000

$2.370

$1.029

$0.754

-

Mouser Electronics

USA . 6,000 parts In-Stock

1+ parts

$2.370

100+ parts

$1.030

1k+ parts

$0.755

10k+ parts

$0.689

6,000

$2.370

$1.030

$0.755

$0.689

Rochester

USA . 10,534 parts In-Stock

1+ parts

-

100+ parts

$1.120

1k+ parts

$0.928

10k+ parts

$0.828

10,534

-

$1.120

$0.928

$0.828

Verical

USA . 3,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.161

10k+ parts

$1.035

3,775

-

-

$1.161

$1.035

Flip Electronics (Authorized)

USA . 3,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,447

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,270 parts In-Stock

1+ parts

$0.521

100+ parts

-

1k+ parts

-

10k+ parts

-

1,270

$0.521

-

-

-

Nova Conductors

Japan . 20 parts In-Stock

1+ parts

$1.018

100+ parts

-

1k+ parts

-

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20

$1.018

-

-

-

Sensible Micro Corp

USA . 9,000 parts In-Stock

1+ parts

-

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9,000

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Vyrian

USA . 6,146 parts In-Stock

1+ parts

-

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6,146

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Flip Electronics

USA . 3,447 parts In-Stock

1+ parts

-

100+ parts

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3,447

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Bristol Electronics

USA . 436 parts In-Stock

1+ parts

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436

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NexGen Digital

USA . 12 parts In-Stock

1+ parts

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 5,827 parts In-Stock

1+ parts

$0.466

100+ parts

$0.454

1k+ parts

$0.452

10k+ parts

-

5,827

$0.466

$0.454

$0.452

-

Ampacity Inc.

Singapore . 5,752 parts In-Stock

1+ parts

$0.466

100+ parts

-

1k+ parts

-

10k+ parts

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5,752

$0.466

-

-

-

Corphita

USA . 1,191 parts In-Stock

1+ parts

$0.493

100+ parts

-

1k+ parts

-

10k+ parts

-

1,191

$0.493

-

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$0.548

100+ parts

$0.521

1k+ parts

$0.521

10k+ parts

-

200

$0.548

$0.521

$0.521

-

Corohmni

South Africa . 468 parts In-Stock

1+ parts

$0.548

100+ parts

-

1k+ parts

-

10k+ parts

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468

$0.548

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.018

100+ parts

$0.997

1k+ parts

-

10k+ parts

-

100

$1.018

$0.997

-

-

Component Stockers USA

USA . 32,176 parts In-Stock

1+ parts

$1.480

100+ parts

$1.200

1k+ parts

$0.900

10k+ parts

$0.810

32,176

$1.480

$1.200

$0.900

$0.810

Aztec Data Supply Inc.

USA . 23,578 parts In-Stock

1+ parts

$1.716

100+ parts

-

1k+ parts

-

10k+ parts

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23,578

$1.716

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Microchip USA

USA . 6,322 parts In-Stock

1+ parts

$6.144

100+ parts

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6,322

$6.144

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Lixinc

USA . 10,108 parts In-Stock

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10,108

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TANS Electronics

Latvia . 8,124 parts In-Stock

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8,124

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Problanco Electronics

Mexico . 6,490 parts In-Stock

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6,490

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Kulean Microsystems

USA . 5,009 parts In-Stock

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5,009

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Argo Parts USA

USA . 4,667 parts In-Stock

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4,667

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Continental Prestige Electronics

USA . 3,544 parts In-Stock

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3,544

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SupplyDigital Components

Austria . 3,424 parts In-Stock

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3,424

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Supply Digital

USA . 2,633 parts In-Stock

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2,633

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UHIMA Technologies

Türkiye . 841 parts In-Stock

1+ parts

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841

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Overview

Power up your projects with the FDMC8360LET40 by Onsemi, a top-quality Power Field Effect Transistor that delivers exceptional performance and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL transistor is perfect for a wide range of switching applications. With a high DS breakdown voltage of 40V and maximum drain current of 141A, this transistor offers unparalleled value and benefits to customers looking for efficiency and durability in their designs. Trust Onsemi for cutting-edge technology and superior products that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability, making the product suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL configuration allows for efficient switching operations, making this FET a good choice for various power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances the overall performance of the FET, making it a convenient choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides high performance and reliability in controlling power flow.

Surface Mount: YES

Being surface mountable offers ease of installation and space-saving benefits, making it suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 40 V

The 40V minimum breakdown voltage ensures reliable operation and protection against voltage spikes, making it suitable for a variety of power applications.

Package Shape: SQUARE

The square package shape allows for easy mounting and efficient use of board space, making it a practical choice for compact electronic designs.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the design and assembly process, contributing to cost-effectiveness and ease of use.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers precise control and efficient switching characteristics, making it ideal for various power management applications.

Maximum Pulsed Drain Current (IDM): 658 A

With a high pulsed drain current rating of 658A, this FET can handle peak power demands with ease, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 253 mJ

The high avalanche energy rating of 253mJ ensures reliable operation under harsh conditions and provides protection against voltage transients.

Maximum Drain Current (Abs) (ID): 141 A

With a maximum drain current of 141A, this FET can handle high power loads efficiently, making it a reliable choice for power switching applications.

No. of Terminals: 5

The 5 terminals offer flexibility in circuit design and connections, making it versatile and adaptable to various electronic applications.

Maximum Power Dissipation (Abs): 75 W

The high power dissipation rating of 75W allows the FET to handle significant power levels without overheating, ensuring long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable board space and allows for dense packing, making it suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in power switching applications, ensuring efficient power management.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can withstand high-temperature environments and ensure reliable operation under varying conditions.

Transistor Element Material: SILICON

Silicon material provides excellent performance and reliability in power switching applications, ensuring long-term durability and efficiency.

Maximum Turn On Time (ton): 42 ns

The fast turn-on time of 42ns ensures quick response and efficient switching operations, making it suitable for high-speed applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this FET can operate in extreme cold environments, making it suitable for a wide range of applications.

Maximum Turn Off Time (toff): 71 ns

The fast turn-off time of 71ns ensures quick switching and efficient power management, making it ideal for high-speed applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides a durable and reliable connection, ensuring long-term performance and protection against corrosion.

Maximum Drain Current (ID): 141 A

With a maximum drain current of 141A, this FET can handle high power loads efficiently, making it a reliable choice for power switching applications.

Maximum Drain-Source On Resistance: 0.0021 ohm

The low drain-source on-resistance of 0.0021 ohms ensures minimal power loss and efficient power flow, making it suitable for high-current applications.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit design and connection options, making it versatile and adaptable to various electronic applications.

Case Connection: DRAIN

The drain case connection simplifies the circuit design and assembly process, contributing to ease of use and reliability in power switching applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this FET can withstand soldering processes without degrading performance, ensuring reliable operation.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliable connections, contributing to long-term performance and durability of the FET.

Maximum Feedback Capacitance (Crss): 80 pF

The low feedback capacitance of 80pF ensures minimal signal distortion and efficient operation, making it suitable for high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) FDMC8360LET40 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

253 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

141 A

Maximum Drain Current (ID):

141 A

Maximum Drain-Source On Resistance:

.0021 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

80 pF

JEDEC-95 Code:

MO-240BA

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

658 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

71 ns

Maximum Turn On Time (ton):

42 ns

Trade Compliance

FDMC8360LET40 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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