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FDMA1028NZTR

Onsemi

FDMA1028NZTR by Onsemi

FDMA1028NZTR by Onsemi is an N-CHANNEL Power FET with 2 elements and built-in diode, ideal for switching applications. It features a max pulsed drain current of 6A, min DS breakdown voltage of 20V, and max power dissipation of 1.4W. This MOSFET operates in enhancement mode with a package style of small outline, suitable for surface mount applications in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,280 parts In-Stock

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Digiode

USA . 353 parts In-Stock

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353

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Native Components

USA . 275 parts In-Stock

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$1.975

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Northwest PG Solutions

USA . 1,677 parts In-Stock

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$2.173

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Problanco Electronics

Mexico . 6,089 parts In-Stock

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Kulean Microsystems

USA . 4,929 parts In-Stock

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SupplyDigital Components

Austria . 3,300 parts In-Stock

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Corphita

USA . 2,131 parts In-Stock

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TANS Electronics

Latvia . 1,684 parts In-Stock

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UHIMA Technologies

Türkiye . 646 parts In-Stock

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Corohmni

South Africa . 88 parts In-Stock

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Overview

Enhance your electronic devices with the FDMA1028NZTR by Onsemi, a high-quality Power Field Effect Transistor perfect for switching applications. Manufactured by industry leader Onsemi, this N-CHANNEL FET offers reliable performance and built-in diode elements in a compact square package. With a maximum drain current of 3.7A and low on-resistance, this transistor is designed for efficiency and durability. Upgrade your devices today with the FDMA1028NZTR and experience the superior quality and performance that Onsemi is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a long lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for high power applications due to their lower ON-state resistance, making them efficient for switching purposes.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for flexibility in circuit design and the built-in diode offers protection against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast switching speeds and efficient power handling capabilities.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making it ideal for mass production and compact designs.

Technical Specifications

Power Field Effect Transistors (FET) FDMA1028NZTR attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

3.7 A

Maximum Drain-Source On Resistance:

.068 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

60 pF

JEDEC-95 Code:

MO-229VCCC

JESD-30 Code:

S-PDSO-N6

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

6 A

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

32 ns

Maximum Turn On Time (ton):

32 ns

Trade Compliance

FDMA1028NZTR Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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