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FDMA910PZ

Onsemi

FDMA910PZ by Onsemi

The Onsemi FDMA910PZ is a P-CHANNEL FET with 20V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A Max IDM and 0.02 ohm RDS(ON), operating in ENHANCEMENT MODE. With a compact SQUARE package and SILICON element material, it offers efficient performance up to 150 °C.

Median Price

$1.102

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,648 parts In-Stock

1+ parts

$0.940

100+ parts

-

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1,648

$0.940

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Digiode

USA . 1,806 parts In-Stock

1+ parts

$1.264

100+ parts

-

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1,806

$1.264

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Flip Electronics

USA . 21,000 parts In-Stock

1+ parts

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21,000

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Netsource Technology, Inc.

USA . 1,425 parts In-Stock

1+ parts

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1,425

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Prism Electronics

USA . 408 parts In-Stock

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408

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 175 parts In-Stock

1+ parts

$0.940

100+ parts

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175

$0.940

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Corphita

USA . 1,225 parts In-Stock

1+ parts

$1.197

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1,225

$1.197

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Native Components

USA . 149 parts In-Stock

1+ parts

$13.622

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149

$13.622

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Northwest PG Solutions

USA . 530 parts In-Stock

1+ parts

$14.984

100+ parts

$13.486

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-

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530

$14.984

$13.486

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RC Electronics

USA . 79,761 parts In-Stock

1+ parts

-

100+ parts

$0.510

1k+ parts

$0.470

10k+ parts

$0.450

79,761

-

$0.510

$0.470

$0.450

Perfect Parts

USA . 15,926 parts In-Stock

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15,926

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iodParts Technologies Inc.

India . 15,926 parts In-Stock

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15,926

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TANS Electronics

Latvia . 8,398 parts In-Stock

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8,398

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Problanco Electronics

Mexico . 6,152 parts In-Stock

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6,152

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Kulean Microsystems

USA . 6,040 parts In-Stock

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6,040

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SupplyDigital Components

Austria . 5,407 parts In-Stock

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5,407

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Eastek

USA . 3,000 parts In-Stock

1+ parts

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1k+ parts

$0.730

10k+ parts

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3,000

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$0.730

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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Supply Digital

USA . 1,671 parts In-Stock

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1,671

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UHIMA Technologies

Türkiye . 872 parts In-Stock

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872

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Overview

Unleash the power of innovation with the FDMA910PZ by Onsemi. As a leading manufacturer in the industry, Onsemi brings you reliable and high-quality Power Field Effect Transistors that are perfect for switching applications. With its P-Channel configuration and built-in diode, this transistor offers enhanced performance and efficiency. Say goodbye to overheating and hello to a seamless operation with a maximum operating temperature of 150 °C. Experience the benefits of fast turn-on time and low on-resistance, providing exceptional value and reliability to your projects. Elevate your designs with the FDMA910PZ and witness the difference it can make in your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high efficiency, making this product suitable for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection and simplifies circuit design, making this FET a convenient choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high performance and reliability in controlling power flow.

Surface Mount: YES

Being surface mount compatible, this FET is easy to integrate into PCB designs, saving space and simplifying assembly processes.

Technical Specifications

Power Field Effect Transistors (FET) FDMA910PZ attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

9.4 A

Maximum Drain Current (ID):

9.4 A

Maximum Drain-Source On Resistance:

.02 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

580 pF

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

381 ns

Maximum Turn On Time (ton):

53 ns

Trade Compliance

FDMA910PZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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