Loading...

FDMA8878-F130

Onsemi

FDMA8878-F130 by Onsemi

FDMA8878-F130 by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 40A IDM. Ideal for SWITCHING applications, it features a 0.016 ohm Drain-Source Resistance and operates b/w -55 to 150 °C. Suitable for surface mount, this transistor has a DUAL terminal position and built-in diode in a SQUARE package.

Median Price

$0.810

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,337,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.440

1,337,705

-

-

-

$0.440

Flip Electronics (Authorized)

USA . 1,337,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,337,705

-

-

-

-

Rochester

USA . 289,315 parts In-Stock

1+ parts

-

100+ parts

$0.810

1k+ parts

$0.672

10k+ parts

$0.600

289,315

-

$0.810

$0.672

$0.600

Verical

USA . 285,425 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.841

10k+ parts

$0.750

285,425

-

-

$0.841

$0.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,246 parts In-Stock

1+ parts

$0.560

100+ parts

-

1k+ parts

-

10k+ parts

-

2,246

$0.560

-

-

-

Digiode

USA . 1,150 parts In-Stock

1+ parts

$0.632

100+ parts

-

1k+ parts

-

10k+ parts

-

1,150

$0.632

-

-

-

Flip Electronics

USA . 1,337,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,337,705

-

-

-

-

DigiKey Marketplace

USA . 1,337,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.554

10k+ parts

-

1,337,705

-

-

$0.554

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,021 parts In-Stock

1+ parts

$0.598

100+ parts

-

1k+ parts

-

10k+ parts

-

2,021

$0.598

-

-

-

Corohmni

South Africa . 244 parts In-Stock

1+ parts

$0.994

100+ parts

-

1k+ parts

-

10k+ parts

-

244

$0.994

-

-

-

Microchip USA

USA . 7,120 parts In-Stock

1+ parts

$3.510

100+ parts

-

1k+ parts

-

10k+ parts

-

7,120

$3.510

-

-

-

Continental Prestige Electronics

USA . 239,472 parts In-Stock

1+ parts

-

100+ parts

$0.800

1k+ parts

-

10k+ parts

-

239,472

-

$0.800

-

-

TANS Electronics

Latvia . 6,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,331

-

-

-

-

Kulean Microsystems

USA . 6,212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,212

-

-

-

-

SupplyDigital Components

Austria . 5,546 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,546

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 4,521 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,521

-

-

-

-

Problanco Electronics

Mexico . 1,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,801

-

-

-

-

UHIMA Technologies

Türkiye . 935 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

935

-

-

-

-

Native Components

USA . 532 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.187

10k+ parts

-

532

-

-

$3.187

-

Northwest PG Solutions

USA . 384 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.220

10k+ parts

-

384

-

-

$3.220

-

Overview

Unleash the power of innovation with the Onsemi FDMA8878-F130 Power Field Effect Transistor. Designed with cutting-edge technology and precision engineering, this N-CHANNEL FET offers unrivaled performance in switching applications. With a maximum pulsed drain current of 40A and a minimum DS breakdown voltage of 30V, this transistor delivers reliability and efficiency like never before. Let your projects soar to new heights with the quality and value that Onsemi brings to the table. Elevate your designs and experience the difference with the FDMA8878-F130.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance and efficiency compared to P-Channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit from reverse current flow, adding an extra level of protection to the system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can rapidly turn on and off, making it suitable for high-speed switching circuits.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making it suitable for modern electronic devices.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, ensuring reliable operation in various conditions.

Maximum Drain Current (ID): 9 A

Capable of handling high currents, making it suitable for power applications that require high current levels.

Maximum Drain-Source On Resistance: 0.016 ohm

Low on-resistance leads to lower power dissipation and higher efficiency, making this FET a good choice for power applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can operate in a wide range of environments without thermal issues.

Technical Specifications

Power Field Effect Transistors (FET) FDMA8878-F130 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

35 pF

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDMA8878-F130 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20