Loading...

DL-LS42

Onsemi

DL-LS42 by Onsemi

DL-LS42 by Onsemi is a 640nm LASER DIODE with AlGaInP material. It operates b/w -10 °C to 60°C, featuring THROUGH HOLE MOUNT. Ideal for applications requiring precise laser emission in various industries.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,843

-

-

-

-

Digiode

USA . 1,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,149

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 71 parts In-Stock

1+ parts

$509.830

100+ parts

$499.633

1k+ parts

$494.535

10k+ parts

$489.437

71

$509.830

$499.633

$494.535

$489.437

Northwest PG Solutions

USA . 27 parts In-Stock

1+ parts

$560.813

100+ parts

-

1k+ parts

-

10k+ parts

-

27

$560.813

-

-

-

Kulean Microsystems

USA . 7,961 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,961

-

-

-

-

SupplyDigital Components

Austria . 4,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,780

-

-

-

-

Problanco Electronics

Mexico . 2,954 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,954

-

-

-

-

Corphita

USA . 1,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,138

-

-

-

-

UHIMA Technologies

Türkiye . 441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

441

-

-

-

-

Corohmni

South Africa . 340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

340

-

-

-

-

TANS Electronics

Latvia . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Overview

Experience the superior quality and reliability of the DL-LS42 Laser Diode by Onsemi. With a peak wavelength of 640nm, this laser diode offers precision and consistency in a wide range of applications. Whether used in medical devices, industrial equipment, or consumer electronics, the DL-LS42 delivers exceptional performance. Trust Onsemi's expertise in semiconductor technology to provide you with a product that exceeds expectations. Upgrade your projects with the DL-LS42 and enjoy the benefits of top-notch quality and unmatched value.

Feature Benefit Bullets

Peak Wavelength (nm): 640

The peak wavelength of 640nm provides a specific and precise laser output, making it suitable for various applications such as medical devices and industrial equipment.

Optoelectronic Type: LASER DIODE

The use of laser diode technology ensures efficient and reliable operation, making this product a cost-effective choice for long-term use.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60 °C, this laser diode can withstand high temperatures, making it suitable for demanding environments.

Minimum Operating Temperature: -10 °C

The ability to operate effectively at low temperatures down to -10 °C allows for versatility in usage scenarios, especially in colder climates or refrigerated environments.

Semiconductor Material: AlGaInP

The use of AlGaInP semiconductor material ensures stable performance and longevity, providing consistent laser output over time for reliable operation.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature simplifies the installation process and provides a secure and stable connection, making it easy to integrate this laser diode into various systems and devices.

Technical Specifications

Laser Diodes DL-LS42 attributes and parameters. Explore more Laser Diodes devices from Onsemi

Specs

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Optoelectronic Type:

Peak Wavelength (nm):

640

Semiconductor Material:

AlGaInP

Sub-Category:

Laser Diodes

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20