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CAT28F001L-12T

Onsemi

CAT28F001L-12T by Onsemi

CAT28F001L-12T by Onsemi is a 128KX8 NOR flash memory with 100000 Write/Erase Cycles endurance. Operating at 5V, it has a max access time of 120ns and offers parallel interface. Ideal for applications requiring fast data access and reliable storage in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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J2 Sourcing AB

Sweden . 8,832 parts In-Stock

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Digiode

USA . 690 parts In-Stock

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690

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Vyrian

USA . 516 parts In-Stock

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516

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Nova Conductors

Japan . 74 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 488 parts In-Stock

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$2.000

100+ parts

$1.950

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$1.940

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488

$2.000

$1.950

$1.940

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$3.509

100+ parts

$3.193

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$2.877

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50

$3.509

$3.193

$2.877

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Ampacity Inc.

Singapore . 1,585 parts In-Stock

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$4.000

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$4.000

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

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$4.639

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300

$4.639

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AZTECH Wire

Italy . 516 parts In-Stock

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$17.329

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516

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Component Stockers USA

USA . 763 parts In-Stock

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$99.990

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763

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Problanco Electronics

Mexico . 8,105 parts In-Stock

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Continental Prestige Electronics

USA . 4,828 parts In-Stock

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SupplyDigital Components

Austria . 3,577 parts In-Stock

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TANS Electronics

Latvia . 3,331 parts In-Stock

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Corphita

USA . 1,602 parts In-Stock

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Argo Parts USA

USA . 917 parts In-Stock

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Kulean Microsystems

USA . 777 parts In-Stock

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Corohmni

South Africa . 494 parts In-Stock

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UHIMA Technologies

Türkiye . 341 parts In-Stock

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341

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Microchip USA

USA . 241 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Unleash the power of reliable and high-quality flash memory with the CAT28F001L-12T by Onsemi. This cutting-edge product offers unparalleled value and benefits for a wide range of applications. Onsemi's commitment to excellence shines through in this versatile memory solution, providing customers with top-notch performance and durability. Trust in the expertise of Onsemi to deliver a superior product that meets all your memory needs. Elevate your projects with the CAT28F001L-12T and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into various electronic systems.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode ensures efficient and fast data transfer, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this product is compatible with a wide range of systems and applications.

Power Supplies (V): 5

The 5V power supply ensures consistent and stable power delivery, reducing the risk of data loss or corruption.

No. of Terminals: 32

The 32 terminals provide ample connectivity options, allowing for versatile usage in different setups.

Package Style (Meter): IN-LINE

The in-line package style offers a space-saving design, suitable for applications with limited space availability.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments without compromising performance.

Organization: 128KX8

The 128KX8 organization provides ample storage capacity and efficient data organization for optimal performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in cold environments.

No. of Sectors/Size: 1,2,1

The availability of multiple sectors and sizes allows for flexible storage and data management options.

Terminal Finish: TIN

The tin terminal finish ensures strong and reliable connections, reducing the risk of signal interruptions.

Terminal Position: DUAL

The dual terminal position provides secure connections and enhances overall system stability.

Maximum Seated Height: 5.08 mm

The low seated height of 5.08mm makes this product suitable for slim and compact devices.

Width: 15.24 mm

The 15.24mm width offers a compact form factor, ideal for applications where space is limited.

Technical Specifications

Flash Memory CAT28F001L-12T attributes and parameters. Explore more Flash Memory devices from Onsemi

Specs

Maximum Access Time:

120 ns

Additional Features:

TOP BOOT BLOCK

Boot Block:

TOP

Command User Interface:

YES

Data Polling:

NO

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3

Length:

42.03 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

1,2,1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP32,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Programming Voltage (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sector Size (Words):

8K,4K,112K

Maximum Standby Current:

.000001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Toggle Bit:

NO

Type:

NOR TYPE

Width:

15.24 mm

Trade Compliance

CAT28F001L-12T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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