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BFL4026-1E

Onsemi

BFL4026-1E by Onsemi

BFL4026-1E by Onsemi is a N-channel Power FET with 900V DS breakdown voltage and 3.6 ohm max RDS(on). Ideal for applications requiring 10A pulsed drain current, such as power supplies and motor control systems. Package style: Flange mount, terminal finish: Matte Tin, and isolated case connection.

Median Price

$1.220

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 40 parts In-Stock

1+ parts

$0.644

100+ parts

$0.586

1k+ parts

$0.528

10k+ parts

-

40

$0.644

$0.586

$0.528

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Rochester

USA . 56,890 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.090

10k+ parts

$1.020

56,890

-

$1.220

$1.090

$1.020

Farnell

UK . 56,540 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.630

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56,540

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$1.630

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Flip Electronics (Authorized)

USA . 53 parts In-Stock

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53

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Distributors (In-Stock)

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Digiode

USA . 2,338 parts In-Stock

1+ parts

$0.612

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-

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2,338

$0.612

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Vyrian

USA . 803 parts In-Stock

1+ parts

$0.644

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803

$0.644

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Flip Electronics

USA . 53 parts In-Stock

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53

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Distributors (Availability)

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Ampacity Inc.

Singapore . 27,933 parts In-Stock

1+ parts

$0.550

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-

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27,933

$0.550

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Corphita

USA . 1,358 parts In-Stock

1+ parts

$0.580

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1,358

$0.580

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Corohmni

South Africa . 59 parts In-Stock

1+ parts

$0.644

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59

$0.644

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$0.644

100+ parts

$0.586

1k+ parts

$0.528

10k+ parts

-

40

$0.644

$0.586

$0.528

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Microchip USA

USA . 7,974 parts In-Stock

1+ parts

$18.590

100+ parts

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7,974

$18.590

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Continental Prestige Electronics

USA . 49,228 parts In-Stock

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$1.630

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49,228

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$1.630

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Kulean Microsystems

USA . 7,382 parts In-Stock

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7,382

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SupplyDigital Components

Austria . 6,546 parts In-Stock

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Problanco Electronics

Mexico . 5,382 parts In-Stock

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TANS Electronics

Latvia . 2,361 parts In-Stock

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2,361

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 952 parts In-Stock

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952

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Native Components

USA . 774 parts In-Stock

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774

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UHIMA Technologies

Türkiye . 569 parts In-Stock

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569

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Northwest PG Solutions

USA . 259 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Enhance your power management systems with the BFL4026-1E by Onsemi. With a focus on quality and reliability, this N-CHANNEL Power Field Effect Transistor offers unmatched performance in a variety of applications. From enhancing efficiency to optimizing power distribution, this transistor delivers value and benefits that go beyond expectations. Trust in Onsemi's expertise in semiconductor technology and elevate your projects with the BFL4026-1E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in the specified direction, enhancing the performance of the product.

Minimum DS Breakdown Voltage: 900 V

High breakdown voltage ensures the FET can handle high voltage applications safely and reliably.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for better energy efficiency and protection against reverse currents, making the product more versatile.

Maximum Pulsed Drain Current (IDM): 10 A

Capable of handling high current pulses, making it suitable for demanding applications where peak currents are required.

Avalanche Energy Rating (EAS): 132 mJ

High avalanche energy rating ensures the FET can withstand sudden voltage spikes or surges, improving overall reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high efficiency and fast switching speeds, making the product ideal for power management applications.

Maximum Drain-Source On Resistance: 3.6 ohm

Low on-resistance minimizes power loss and heat generation, improving the efficiency of the product.

Technical Specifications

Power Field Effect Transistors (FET) BFL4026-1E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

132 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

3.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

10 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

BFL4026-1E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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