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BFL4037

Onsemi

BFL4037 by Onsemi

BFL4037 by Onsemi is a N-CHANNEL FET with 11A ID and 40W power dissipation. Ideal for applications requiring high drain current up to 11A, such as power management systems. Operates in enhancement mode with max temp of 150 °C, utilizing metal-oxide semiconductor technology for efficient performance.

Median Price

$3.220

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$2.950

1k+ parts

$2.640

10k+ parts

$2.480

100

-

$2.950

$2.640

$2.480

DigiKey

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$3.220

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100

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$3.220

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Verical

USA . 100 parts In-Stock

1+ parts

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100+ parts

$3.875

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100

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$3.875

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,229 parts In-Stock

1+ parts

$3.116

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1,229

$3.116

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Vyrian

USA . 5,660 parts In-Stock

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5,660

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DigiKey Marketplace

USA . 100 parts In-Stock

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100+ parts

$3.410

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100

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$3.410

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Fibra_Brandt Electronic GMBH

Germany . 9 parts In-Stock

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9

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Distributors (Availability)

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Native Components

USA . 183 parts In-Stock

1+ parts

$1.440

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183

$1.440

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Northwest PG Solutions

USA . 1,334 parts In-Stock

1+ parts

$1.584

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1,334

$1.584

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Corphita

USA . 2,387 parts In-Stock

1+ parts

$2.952

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2,387

$2.952

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Corohmni

South Africa . 439 parts In-Stock

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$3.280

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439

$3.280

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Microchip USA

USA . 5,626 parts In-Stock

1+ parts

$20.475

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5,626

$20.475

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RC Electronics

USA . 11,463 parts In-Stock

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100+ parts

$1.390

1k+ parts

$1.310

10k+ parts

$1.280

11,463

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$1.390

$1.310

$1.280

Kulean Microsystems

USA . 6,011 parts In-Stock

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6,011

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TANS Electronics

Latvia . 5,526 parts In-Stock

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5,526

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Problanco Electronics

Mexico . 3,952 parts In-Stock

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3,952

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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SupplyDigital Components

Austria . 1,122 parts In-Stock

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1,122

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UHIMA Technologies

Türkiye . 964 parts In-Stock

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964

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Unleash the power of innovation with the BFL4037 by Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors (FET), Onsemi sets the standard for quality and reliability. The BFL4037, with its N-CHANNEL configuration and ENHANCEMENT MODE operation, offers unmatched performance and efficiency. Ideal for a wide range of applications, this FET delivers a maximum drain current of 11A and a maximum power dissipation of 40W. Experience the superior technology of METAL-OXIDE SEMICONDUCTOR and push your projects to new heights with the BFL4037. Elevate your designs with Onsemi's cutting-edge solutions.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL - Provides efficient current flow and performance for various applications.

Configuration

SINGLE - Simplifies circuit design and enhances reliability.

Operating Mode

ENHANCEMENT MODE - Allows for easy control of the transistor's conductivity.

Maximum Drain Current (Abs)

11 A - Handles high current loads effectively and reliably.

Maximum Power Dissipation (Abs)

40 W - Can dissipate heat efficiently, ensuring stable operation.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - Offers high speed and low power consumption.

Maximum Operating Temperature

150 °C - Withstands high operating temperatures, ensuring reliability in various conditions.

Maximum Drain Current (ID)

11 A - Provides a high current rating for demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) BFL4037 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

BFL4037 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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