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BFL4001

Onsemi

BFL4001 by Onsemi

BFL4001 by Onsemi is a N-CHANNEL Power FET with 900V DS Breakdown Voltage. Ideal for SWITCHING applications, it has a max IDM of 13A and EAS of 237mJ. The transistor features a single configuration with built-in diode, operating in ENHANCEMENT MODE.

Median Price

$3.550

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,780 parts In-Stock

1+ parts

-

100+ parts

$3.070

1k+ parts

$2.750

10k+ parts

$2.580

9,780

-

$3.070

$2.750

$2.580

DigiKey

USA . 9,780 parts In-Stock

1+ parts

-

100+ parts

$3.550

1k+ parts

$3.550

10k+ parts

$3.550

9,780

-

$3.550

$3.550

$3.550

Verical

USA . 9,780 parts In-Stock

1+ parts

-

100+ parts

$3.837

1k+ parts

$3.438

10k+ parts

$3.225

9,780

-

$3.837

$3.438

$3.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,070 parts In-Stock

1+ parts

$3.240

100+ parts

-

1k+ parts

-

10k+ parts

-

1,070

$3.240

-

-

-

Vyrian

USA . 2,301 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

-

10k+ parts

-

2,301

$3.410

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 782 parts In-Stock

1+ parts

$0.330

100+ parts

-

1k+ parts

-

10k+ parts

$0.317

782

$0.330

-

-

$0.317

Northwest PG Solutions

USA . 594 parts In-Stock

1+ parts

$0.363

100+ parts

-

1k+ parts

-

10k+ parts

$0.320

594

$0.363

-

-

$0.320

Corphita

USA . 1,418 parts In-Stock

1+ parts

$3.069

100+ parts

-

1k+ parts

-

10k+ parts

-

1,418

$3.069

-

-

-

Corohmni

South Africa . 437 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

-

10k+ parts

-

437

$3.410

-

-

-

Component Stockers USA

USA . 10,136 parts In-Stock

1+ parts

$3.440

100+ parts

$3.240

1k+ parts

$2.930

10k+ parts

-

10,136

$3.440

$3.240

$2.930

-

Microchip USA

USA . 306 parts In-Stock

1+ parts

$21.320

100+ parts

-

1k+ parts

-

10k+ parts

-

306

$21.320

-

-

-

Kepictronics

USA . 32,978 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

32,978

-

-

-

-

Continental Prestige Electronics

USA . 9,780 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

-

10k+ parts

-

9,780

-

$3.130

-

-

Problanco Electronics

Mexico . 3,968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,968

-

-

-

-

Glotronic Ltd.

UK . 3,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,700

-

-

-

-

Kulean Microsystems

USA . 2,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,960

-

-

-

-

TANS Electronics

Latvia . 2,067 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,067

-

-

-

-

SupplyDigital Components

Austria . 827 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

827

-

-

-

-

UHIMA Technologies

Türkiye . 666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

666

-

-

-

-

Overview

Experience the power of efficiency with the BFL4001 by Onsemi. Crafted with precision and reliability, this N-CHANNEL Power FET is a game-changer in the world of switching applications. From its robust design to its high performance capabilities, this transistor offers unmatched value and benefits to customers looking to optimize their systems. Trust Onsemi's expertise and elevate your projects with the BFL4001.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and reliability, making this product suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speed, making them ideal for applications where performance is key.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space, making this product convenient for compact electronic systems.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers reliable performance and efficiency in controlling power flow within circuits.

Minimum DS Breakdown Voltage: 900 V

With a high breakdown voltage of 900V, this FET can handle high voltage levels, making it suitable for power electronics applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into circuit designs, enhancing the overall efficiency of the system.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections, ensuring reliable performance and making this product easy to solder onto circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching operation, improving efficiency and reducing power consumption in electronic devices.

Maximum Pulsed Drain Current (IDM): 13 A

With a high pulsed drain current of 13A, this FET can handle peak power demands, making it suitable for applications requiring high current switching.

Avalanche Energy Rating (EAS): 237 mJ

The high avalanche energy rating of 237mJ ensures that this FET can withstand transient voltage spikes, enhancing the overall reliability of the circuit.

No. of Terminals: 3

Having 3 terminals allows for easy connection and integration into circuit designs, simplifying the overall system setup.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides mechanical stability and secure mounting, making this FET suitable for demanding industrial environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making this FET suitable for critical applications where efficiency is key.

Transistor Element Material: SILICON

Silicon is a widely-used material in semiconductor devices due to its excellent electrical properties, ensuring high performance and reliability in this FET.

Terminal Finish: Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

The terminal finish of tin/copper/silver/nickel provides excellent conductivity and corrosion resistance, enhancing the longevity and reliability of this FET.

Maximum Drain Current (ID): 6.5 A

With a maximum drain current of 6.5A, this FET can handle moderate power requirements, making it suitable for a wide range of electronic applications.

Maximum Drain-Source On Resistance: 2.7 ohm

The low drain-source on resistance of 2.7 ohms reduces power losses and improves efficiency in switching applications, making this FET a cost-effective choice.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection process and ensures proper alignment, making this FET easy to integrate into circuit designs.

Case Connection: ISOLATED

The isolated case connection enhances safety and reliability by preventing electrical interference and ensuring proper grounding in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) BFL4001 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

237 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (ID):

6.5 A

Maximum Drain-Source On Resistance:

2.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

13 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BFL4001 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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