Loading...

BF245ARL

Onsemi

BF245ARL by Onsemi

BF245ARL by Onsemi is an N-CHANNEL RF FET with 30V DS breakdown voltage. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it has a max ID of 0.1A and operates in DEPLETION MODE. Package: PLASTIC/EPOXY, Shape: ROUND, Terminals: 3.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

785

-

-

-

-

Vyrian

USA . 441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

441

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 389 parts In-Stock

1+ parts

$0.120

100+ parts

-

1k+ parts

-

10k+ parts

$0.116

389

$0.120

-

-

$0.116

Northwest PG Solutions

USA . 2,358 parts In-Stock

1+ parts

$0.132

100+ parts

-

1k+ parts

-

10k+ parts

$0.117

2,358

$0.132

-

-

$0.117

TANS Electronics

Latvia . 8,270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,270

-

-

-

-

Kulean Microsystems

USA . 3,049 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,049

-

-

-

-

Problanco Electronics

Mexico . 2,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,713

-

-

-

-

UHIMA Technologies

Türkiye . 779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

779

-

-

-

-

Corphita

USA . 522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

522

-

-

-

-

Corohmni

South Africa . 427 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

427

-

-

-

-

SupplyDigital Components

Austria . 140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

140

-

-

-

-

Overview

The BF245ARL by Onsemi is a top-notch RF Small Signal Field Effect Transistor that offers unmatched quality and reliability. With Onsemi being a renowned manufacturer known for producing high-performance components, you can trust in the durability and efficiency of this transistor. Ideal for amplifier applications, this N-CHANNEL transistor operates in depletion mode and is designed for ultra-high frequency bands. Providing a seamless performance with a minimum DS breakdown voltage of 30V, this transistor is a valuable asset for any electronic project. Upgrade your amplification system with the BF245ARL and experience the superior benefits it brings to your devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the transistor, making it suitable for various applications and environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and conductivity, offering better performance in terms of speed and efficiency.

Configuration: SINGLE

Single configuration simplifies the setup and operation of the transistor, making it easy to integrate into circuit designs.

Transistor Application: AMPLIFIER

Designed specifically for amplification purposes, this transistor is optimized for high-gain applications where signal strength is critical.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this transistor can handle higher voltages without experiencing failure or breakdown, ensuring reliability in operation.

Package Shape: ROUND

Round package shape allows for easy mounting and installation, making it convenient to use in various circuit layouts and designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides stability and secure connection with the circuit board, reducing the risk of disconnection or malfunction.

Operating Mode: DEPLETION MODE

Depletion mode operation offers better control and regulation of the transistor's output signal, enhancing its performance in amplification circuits.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, this transistor is capable of handling high-speed signals with minimal distortion or loss.

No. of Terminals: 3

Three terminals provide the necessary connections for input, output, and biasing, allowing for easy integration into circuit designs.

Package Style (Meter): CYLINDRICAL

Cylindrical package style offers a compact and space-saving design, making it ideal for applications where size constraints are a concern.

Field Effect Transistor Technology: JUNCTION

Junction technology provides better control and performance compared to other FET technologies, ensuring reliable operation in demanding applications.

Transistor Element Material: SILICON

Silicon material offers high reliability and durability, making the transistor suitable for long-term use in various electronic devices and systems.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and corrosion resistance, ensuring stable and reliable connections with the circuit board.

Maximum Drain Current (ID): 0.1 A

With a maximum drain current of 0.1 A, this transistor can handle moderate power levels without overheating or performance degradation.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering on the circuit board, ensuring secure and reliable connections for optimal performance.

Technical Specifications

RF Small Signal Field Effect Transistors (FET) BF245ARL attributes and parameters. Explore more RF Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.1 A

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BF245ARL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20