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7WBD383USG

Onsemi

7WBD383USG by Onsemi

BUS DRIVER; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR;

Median Price

$0.322

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,354 parts In-Stock

1+ parts

-

100+ parts

$0.322

1k+ parts

$0.267

10k+ parts

$0.238

6,354

-

$0.322

$0.267

$0.238

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 454 parts In-Stock

1+ parts

$0.251

100+ parts

-

1k+ parts

-

10k+ parts

-

454

$0.251

-

-

-

Flip Electronics

USA . 78,000 parts In-Stock

1+ parts

-

100+ parts

-

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78,000

-

-

-

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Vyrian

USA . 4,342 parts In-Stock

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-

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4,342

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Semtec, LLC

USA . 1,050 parts In-Stock

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-

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1,050

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 487 parts In-Stock

1+ parts

$0.220

100+ parts

-

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-

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487

$0.220

-

-

-

Corphita

USA . 653 parts In-Stock

1+ parts

$0.238

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-

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653

$0.238

-

-

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AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$18.430

100+ parts

-

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-

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559

$18.430

-

-

-

Native Components

USA . 322 parts In-Stock

1+ parts

$31.986

100+ parts

-

1k+ parts

-

10k+ parts

$30.707

322

$31.986

-

-

$30.707

Northwest PG Solutions

USA . 72 parts In-Stock

1+ parts

$35.185

100+ parts

-

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72

$35.185

-

-

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

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20,000

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TANS Electronics

Latvia . 8,214 parts In-Stock

1+ parts

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8,214

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-

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SupplyDigital Components

Austria . 5,960 parts In-Stock

1+ parts

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5,960

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Kepictronics

USA . 4,000 parts In-Stock

1+ parts

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4,000

-

-

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Problanco Electronics

Mexico . 3,845 parts In-Stock

1+ parts

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3,845

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-

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Continental Prestige Electronics

USA . 3,370 parts In-Stock

1+ parts

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$0.320

10k+ parts

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3,370

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$0.320

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Perfect Parts

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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UHIMA Technologies

Türkiye . 783 parts In-Stock

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783

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Microchip USA

USA . 608 parts In-Stock

1+ parts

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608

-

-

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Kulean Microsystems

USA . 607 parts In-Stock

1+ parts

-

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10k+ parts

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607

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-

-

-

Technical Specifications

Bus Driver & Transceivers 7WBD383USG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G8

Length:

2.3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

7WBD383USG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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