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3EZ36D5

Onsemi

3EZ36D5 by Onsemi

The Onsemi 3EZ36D5 is a Zener diode with a nominal reference voltage of 36V and max power dissipation of 1W. It operates at a max temperature of 200 °C, making it suitable for high-temperature applications. With a working test current of 21mA and max voltage tolerance of 5%, it is commonly used in electronic circuits requiring precise voltage regulation.

Median Price

$0.063

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 8,000 parts In-Stock

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$0.105

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$0.105

Arrow

USA . 4,882 parts In-Stock

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$0.063

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$0.063

Chip1Stop

Japan . 4,882 parts In-Stock

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$0.042

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$0.035

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$0.035

4,882

-

$0.042

$0.035

$0.035

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Digiode

USA . 2,022 parts In-Stock

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$0.037

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Vyrian

USA . 1,396 parts In-Stock

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$0.039

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$0.039

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Corphita

USA . 417 parts In-Stock

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$0.035

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417

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Corohmni

South Africa . 453 parts In-Stock

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$0.039

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453

$0.039

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Kepictronics

USA . 39,000 parts In-Stock

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SupplyDigital Components

Austria . 8,103 parts In-Stock

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Kulean Microsystems

USA . 7,983 parts In-Stock

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TANS Electronics

Latvia . 6,835 parts In-Stock

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Problanco Electronics

Mexico . 3,096 parts In-Stock

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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Northwest PG Solutions

USA . 1,970 parts In-Stock

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UHIMA Technologies

Türkiye . 750 parts In-Stock

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Native Components

USA . 34 parts In-Stock

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Overview

Unlock the power of precision with the 3EZ36D5 Zener Diode by Onsemi. Crafted with expertise and care, this single-configured diode offers a nominal reference voltage of 36V and maximum voltage tolerance of 5%. Ideal for a wide range of applications, from automotive electronics to industrial machinery, this diode ensures stable performance and reliability in any situation. Experience peace of mind knowing that you are getting top-notch quality and value with the 3EZ36D5 - the perfect choice for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material ensures durability and protection for the Zener diode, making it suitable for various applications.

Working Test Current: 21 mA

The high working test current of 21 mA indicates that the Zener diode can handle higher current loads, providing reliable performance in demanding circuits.

Maximum Voltage Tolerance: 5 %

The tight maximum voltage tolerance of 5% ensures accurate and consistent performance, making it suitable for precision applications.

Maximum Operating Temperature: 200 °C

The high maximum operating temperature of 200 °C allows the Zener diode to operate in harsh environments without compromising its performance.

Maximum Power Dissipation: 1 W

The high maximum power dissipation of 1 W indicates that the Zener diode can handle high power loads, making it suitable for power electronics applications.

Nominal Reference Voltage: 36 V

The nominal reference voltage of 36 V provides stable and accurate voltage regulation, making it ideal for voltage reference applications.

Technical Specifications

Zener Diodes 3EZ36D5 attributes and parameters. Explore more Zener Diodes devices from Onsemi

Specs

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

22 ohm

JEDEC-95 Code:

DO-41

JESD-30 Code:

O-PALF-W2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

LONG FORM

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

1 W

Qualification:

Not Qualified

Nominal Reference Voltage:

36 V

Sub-Category:

Voltage Reference Diodes

Surface Mount:

NO

Technology:

ZENER

Terminal Form:

Terminal Position:

Maximum Voltage Tolerance:

5 %

Working Test Current:

21 mA

Trade Compliance

3EZ36D5 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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