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2H4819

Onsemi

2H4819 by Onsemi

The Onsemi 2H4819 Image Sensor features 2048x2048 pixels, with a pixel size of 7.4um x 7.4um. It operates b/w -50 °C to 70°C and is designed for through-hole mounting applications in various industries such as automotive, surveillance, and industrial imaging.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,523 parts In-Stock

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Digiode

USA . 405 parts In-Stock

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Kulean Microsystems

USA . 2,930 parts In-Stock

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UHIMA Technologies

Türkiye . 882 parts In-Stock

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Northwest PG Solutions

USA . 544 parts In-Stock

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Problanco Electronics

Mexico . 460 parts In-Stock

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TANS Electronics

Latvia . 343 parts In-Stock

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Corohmni

South Africa . 293 parts In-Stock

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Corphita

USA . 192 parts In-Stock

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SupplyDigital Components

Austria . 86 parts In-Stock

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Native Components

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Overview

Capture every detail with the 2H4819 image sensor by Onsemi. Renowned for their superior quality and reliability, Onsemi delivers cutting-edge technology that meets the demands of various applications. From high-resolution surveillance cameras to advanced medical imaging systems, this image sensor offers exceptional value with its precise pixel size and wide operating temperature range. Elevate your projects with the innovative features and benefits of the 2H4819 image sensor.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

The small pixel size allows for high resolution images, making this image sensor ideal for applications where detail and clarity are crucial.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that this image sensor can perform reliably in various environmental conditions without overheating.

Horizontal Pixel: 2048

With a high number of horizontal pixels, this image sensor delivers sharp and detailed images, making it suitable for applications that require precision.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature means that this image sensor can still function effectively in extremely cold environments, expanding its range of use.

Vertical Pixel: 2048

Matching the high number of horizontal pixels, the vertical pixels also contribute to the overall image quality and resolution of this sensor, ensuring consistent performance.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mount design provides a secure and stable attachment method for the sensor, ensuring accuracy and reliability in its placement and operation.

Technical Specifications

Image Sensors 2H4819 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Horizontal Pixel:

2048

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Pixel Size (um):

7.4X7.4

Sub-Category:

CCD Image Sensors

Vertical Pixel:

2048

Trade Compliance

2H4819 Sensors & Transducers trade compliance attributes, and parameters.

NSN

2520-00-014-6800, 2520000146800

NIIN

000146800

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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