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TDA19978AHV/15,518

NXP Semiconductors

TDA19978AHV/15,518 by NXP Semiconductors

TDA19978AHV/15,518 by NXP Semiconductors is a consumer IC designed for flatpack surface mount applications. It operates at 1.8V and 3.3V with a max temp of 70 °C, featuring 144 terminals in a quad configuration. Ideal for multimedia processing in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,674 parts In-Stock

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6,674

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Digiode

USA . 4,641 parts In-Stock

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4,641

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Anansix

USA . 1,677 parts In-Stock

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1,677

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Distributors (Availability)

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One Stop Electronics

USA . 1,419 parts In-Stock

1+ parts

$18.800

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1,419

$18.800

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AZTECH Wire

Italy . 1,125 parts In-Stock

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$18.870

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1,125

$18.870

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UNI Independent Distributors

Spain . 5,651 parts In-Stock

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5,651

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Microchip USA

USA . 5,386 parts In-Stock

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5,386

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Corphita

USA . 4,702 parts In-Stock

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4,702

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QUARKTWIN TECHNOLOGY LTD

USA . 2,522 parts In-Stock

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2,522

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Overview

Elevate your consumer electronics with the TDA19978AHV/15,518 by NXP Semiconductors, a leader in innovative solutions. This reliable IC delivers exceptional performance and versatility, making it ideal for a wide range of applications—from audio processing to video enhancement. With a commitment to quality and cutting-edge technology, NXP ensures that you receive superior products designed to enhance your devices, streamline operations, and delight end-users. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental stress, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, which is ideal for modern consumer electronics.

Package Shape: SQUARE

The square package shape facilitates uniform heat distribution and simplifies circuit design, optimizing the performance of the IC.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC is tailored to meet the demands of everyday electronic devices.

Power Supplies (V): 1.8, 3.3

Compatible with common voltage levels of 1.8V and 3.3V, this IC enhances versatility and makes it adaptable for a wide range of electronic devices.

No. of Terminals: 144

A high number of terminals provides significant connectivity options, allowing for complex functionalities and features in consumer electronics.

Package Style (Meter): FLATPACK

The flatpack style promotes a low profile, enabling integration into space-constrained designs, which is essential for portable devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is reliable for various consumer applications, ensuring stable performance under normal conditions.

Minimum Operating Temperature: 0 °C

Operational from 0 °C, this IC is suitable for a range of environments, increasing its usability in different temperature conditions.

Terminal Position: QUAD

The quad terminal position allows for efficient connections and aids in maintaining a compact design, enhancing layout flexibility.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature operation, this IC provides reliability and longevity in typical consumer applications.

Technology: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making this IC energy-efficient and suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering reliability and allows for easy mounting, improving manufacturing efficiency.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables a denser layout, facilitating advanced designs and high-functionality devices while maintaining soldering accuracy.

Technical Specifications

Other Function Consumer ICs TDA19978AHV/15,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA19978AHV/15,518 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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