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SA604AD/01

NXP Semiconductors

SA604AD/01 by NXP Semiconductors

SA604AD/01 by NXP Semiconductors is an audio demodulator IC with 16 terminals, operating b/w -40 to 85°C. It offers a signal-to-noise ratio of 73 dB for FM demodulation applications. This small outline package IC supports supply voltages from 4.5V to 8V and has a peak reflow temperature of 260°C, making it ideal for industrial-grade receiver systems.

Median Price

$9.000

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 165 parts In-Stock

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Nova Conductors

Japan . 84 parts In-Stock

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$2.698

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Chip Stock

USA . 15,313 parts In-Stock

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Anansix

USA . 2,757 parts In-Stock

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Diverse Electronics

Canada . 1,180 parts In-Stock

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Vyrian

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Flip Electronics

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Digiode

USA . 85 parts In-Stock

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Sunrise Surplus Inc.

USA . 6 parts In-Stock

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ABC Electronics Ltd.

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Corohmni

South Africa . 838 parts In-Stock

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$0.663

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$0.663

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Aztec Data Supply Inc.

USA . 1,255 parts In-Stock

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$2.650

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Argo Parts USA

USA . 3,343 parts In-Stock

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Continental Prestige Electronics

USA . 440 parts In-Stock

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$2.698

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$2.644

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Netroflash

USA . 50 parts In-Stock

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$2.698

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$2.644

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$2.752

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$2.752

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Ampacity Inc.

Singapore . 254 parts In-Stock

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$7.650

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Semicontronic

India . 528 parts In-Stock

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$16.650

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$16.234

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$16.150

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Lixinc

USA . 12,628 parts In-Stock

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UNI Independent Distributors

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A-Z Elektronik GmbH

Germany . 5,001 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Perfect Parts

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Overview

Discover the superior performance of the SA604AD/01 Receiver IC by NXP Semiconductors. Designed with precision and expertise, this audio demodulator offers unparalleled signal clarity and reliability. Perfect for a wide range of applications, this small outline package is ideal for industrial-grade projects where quality is paramount. With a high signal-to-noise ratio and easy surface mount installation, the SA604AD/01 provides exceptional value and benefits to customers seeking top-notch audio performance. Elevate your project with the trusted quality of NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and cost-effective.

Surface Mount: YES

This product can be easily mounted on a surface, making it convenient for PCB assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the PCB.

General IC Type: AUDIO DEMODULATOR

This product is specifically designed for audio demodulation applications, ensuring high-quality output.

No. of Terminals: 16

With 16 terminals, this product offers versatile connectivity options for different systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving space on the board, ideal for compact designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to be used in a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position offers redundancy and increased reliability in the connection.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75 mm allows for a compact design and easier integration into electronic devices.

Nominal Signal to Noise Ratio (FM): 73 dB

With a high signal to noise ratio, this product delivers clear and crisp audio signals.

Width: 3.9 mm

The compact width of 3.9 mm enables efficient use of PCB space in tight layouts.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement of 4.5 V ensures energy-efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds helps in preventing overheating during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering and component integrity.

Length: 9.9 mm

The length of 9.9 mm provides a balance between compactness and ease of handling during installation.

Demodulation Type: FM

The FM demodulation type ensures compatibility with FM audio signals for accurate decoding.

Temperature Grade: INDUSTRIAL

This industrial-grade temperature rating allows for operation in harsh environmental conditions.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and provides mechanical strength to the connections.

Nominal Output Voltage (FM): 2650 mV

The high nominal output voltage of 2650 mV ensures a strong audio signal output.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm enables precise placement on the PCB for optimal connectivity.

Maximum Supply Voltage (Vsup): 8 V

The high maximum supply voltage of 8 V ensures compatibility with a wide range of power sources.

Technical Specifications

Receiver ICs SA604AD/01 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

2650 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Signal to Noise Ratio (FM):

73 dB

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SA604AD/01 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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