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SA606DK/01-T

NXP Semiconductors

SA606DK/01-T by NXP Semiconductors

SA606DK/01-T by NXP Semiconductors is a Receiver IC with 20 terminals, operating at -40 to 85°C. It features a power supply of 3V and consumes up to 4.2mA. Ideal for industrial applications requiring bipolar technology in a small outline package with gull wing terminals.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

USA . 6,240 parts In-Stock

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Vyrian

USA . 1,487 parts In-Stock

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1,487

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Anansix

USA . 252 parts In-Stock

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252

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Digiode

USA . 173 parts In-Stock

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173

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Nova Conductors

Japan . 78 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,443 parts In-Stock

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$1.070

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$1.070

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Corohmni

South Africa . 428 parts In-Stock

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$1.786

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428

$1.786

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Semicontronic

India . 1,508 parts In-Stock

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$6.800

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$6.630

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$6.596

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1,508

$6.800

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AZTECH Wire

Italy . 575 parts In-Stock

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$11.140

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One Stop Electronics

USA . 279 parts In-Stock

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$17.800

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Ampacity Inc.

Singapore . 1,140 parts In-Stock

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$18.800

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Argo Parts USA

USA . 4,556 parts In-Stock

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UNI Independent Distributors

Spain . 4,009 parts In-Stock

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Continental Prestige Electronics

USA . 1,195 parts In-Stock

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Bastille Electronics

Australia . 968 parts In-Stock

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Corphita

USA . 512 parts In-Stock

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512

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Advanced Electronics

New Zealand . 27 parts In-Stock

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Overview

Elevate your technology with the SA606DK/01-T by NXP Semiconductors, a top-tier receiver IC designed for high-performance applications. With a durable plastic/epoxy package body and small outline design, this IC is built to last in industrial settings. Its low 4.2 mA supply current and wide temperature range make it ideal for a variety of projects. Trust NXP Semiconductors' reputation for quality and innovation, and experience the difference with the SA606DK/01-T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the receiver IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Package Shape: RECTANGULAR

The rectangular shape allows for a compact design, making it easier to integrate the receiver IC into various electronic devices.

Power Supplies (V): 3

The 3V power supply is a common voltage level in many electronic systems, making this receiver IC compatible with a wide range of applications.

No. of Terminals: 20

Having 20 terminals provides more connectivity options and flexibility for circuit design and integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style allows for a space-saving design, ideal for compact electronic devices with limited space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold environments, enhancing the versatility of this receiver IC.

Terminal Position: DUAL

Dual terminal positions offer redundancy and improved signal integrity, ensuring reliable connectivity.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes this receiver IC suitable for a wide range of industrial applications with varying temperature conditions.

Technology: BIPOLAR

Bipolar technology offers high speed and low noise performance, making this receiver IC ideal for applications requiring precise signal reception and processing.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and easy soldering during assembly, ensuring a reliable connection.

Maximum Supply Current: 4.2 mA

The low maximum supply current consumption helps in reducing power consumption and increasing efficiency of the overall system.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for high-density mounting on the PCB, enabling more functionality in a compact space.

Technical Specifications

Receiver ICs SA606DK/01-T attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Receiver ICs

Maximum Supply Current:

4.2 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

SA606DK/01-T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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