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SA604AD/01,118

NXP Semiconductors

SA604AD/01,118 by NXP Semiconductors

SA604AD/01,118 by NXP Semiconductors is a Receiver IC with 16 terminals. It features an AUDIO DEMODULATOR for FM demodulation with a signal to noise ratio of 73 dB. Ideal for industrial applications, it operates b/w -40 to 85 °C and has a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,680 parts In-Stock

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7,680

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Digiode

USA . 3,631 parts In-Stock

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Anansix

USA . 2,672 parts In-Stock

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Flip Electronics

USA . 2,500 parts In-Stock

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Nova Conductors

Japan . 65 parts In-Stock

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65

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,991 parts In-Stock

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$0.480

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$0.480

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Corohmni

South Africa . 578 parts In-Stock

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$2.192

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578

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Semicontronic

India . 1,019 parts In-Stock

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$9.800

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$9.555

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$9.506

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One Stop Electronics

USA . 249 parts In-Stock

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$12.800

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AZTECH Wire

Italy . 412 parts In-Stock

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$14.929

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Ampacity Inc.

Singapore . 1,291 parts In-Stock

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$17.800

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QUARKTWIN TECHNOLOGY LTD

USA . 12,311 parts In-Stock

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UNI Independent Distributors

Spain . 7,977 parts In-Stock

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Epart123

USA . 7,500 parts In-Stock

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Argo Parts USA

USA . 3,301 parts In-Stock

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Continental Prestige Electronics

USA . 1,674 parts In-Stock

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Bastille Electronics

Australia . 1,384 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Discover the NXP Semiconductors SA604AD/01,118, a top-of-the-line Receiver IC designed for superior audio demodulation performance. With a compact design and high signal-to-noise ratio, this innovative product is perfect for a wide range of applications. Benefit from NXP's reputation for quality and reliability, ensuring that your projects meet and exceed expectations. Upgrade your audio systems with the SA604AD/01,118 and experience the difference in sound quality and performance. Elevate your designs with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product cost-effective and reliable.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, saving time and effort.

Package Shape: RECTANGULAR

The rectangular shape helps in optimizing space on the circuit board and improving overall design flexibility.

General IC Type: AUDIO DEMODULATOR

Being an audio demodulator IC, this product is ideal for applications requiring high-quality audio signal processing.

No. of Terminals: 16

With 16 terminals, this IC offers multiple connection options and greater flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can perform reliably even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the IC can function effectively in a wide range of temperature settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, improving the overall longevity of the product.

Terminal Position: DUAL

Dual terminal positions offer redundancy and enhanced electrical connectivity, ensuring stable performance.

Maximum Seated Height: 1.75 mm

The low seated height allows for a compact overall design, making it suitable for space-constrained applications.

Nominal Signal to Noise Ratio (FM): 73 dB

With a high signal to noise ratio, this IC delivers clear audio signals, making it a great choice for audio applications.

Width: 3.9 mm

The narrow width of the IC enables efficient layout on the circuit board, optimizing space.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement makes this IC energy-efficient and cost-effective in operation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering and durability during manufacturing processes.

Length: 9.9 mm

The compact length of the IC contributes to space-saving in circuit board layout and design.

Demodulation Type: FM

Specialized for FM demodulation, this IC is perfect for applications requiring precise frequency modulation processing.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can withstand harsh operating conditions, making it suitable for industrial applications.

Terminal Form: GULL WING

The gull wing terminal form provides a secure connection and ease of soldering, enhancing overall reliability.

Nominal Output Voltage (FM): 530 mV

The high nominal output voltage ensures strong and clear audio signal output for optimal performance.

Terminal Pitch: 1.27 mm

The standard terminal pitch simplifies layout and connection, enhancing ease of use and installation.

Maximum Supply Voltage (Vsup): 8 V

The high maximum supply voltage capability allows for flexibility in voltage requirements, improving versatility in applications.

Technical Specifications

Receiver ICs SA604AD/01,118 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

530 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Signal to Noise Ratio (FM):

73 dB

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

SA604AD/01,118 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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