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SA605DK/01,112

NXP Semiconductors

SA605DK/01,112 by NXP Semiconductors

SA605DK/01,112 by NXP Semiconductors is an audio single chip receiver with 1 function. It operates in a temperature range of -40 to 85°C and has a small outline package style. It is commonly used for FM demodulation applications.

Median Price

$2.807

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$2.807

100+ parts

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1k+ parts

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900

$2.807

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Digiode

USA . 4,435 parts In-Stock

1+ parts

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4,435

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Flip Electronics

USA . 1,330 parts In-Stock

1+ parts

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1,330

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Vyrian

USA . 1,289 parts In-Stock

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1,289

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Anansix

USA . 764 parts In-Stock

1+ parts

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764

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Euro-Tech

UK . 28 parts In-Stock

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28

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$1.435

100+ parts

$1.306

1k+ parts

$1.177

10k+ parts

-

1,000

$1.435

$1.306

$1.177

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Argo Parts USA

USA . 1,680 parts In-Stock

1+ parts

$2.807

100+ parts

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1,680

$2.807

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Bastille Electronics

Australia . 900 parts In-Stock

1+ parts

$2.807

100+ parts

$2.667

1k+ parts

$2.533

10k+ parts

$2.498

900

$2.807

$2.667

$2.533

$2.498

Corohmni

South Africa . 583 parts In-Stock

1+ parts

$2.807

100+ parts

-

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583

$2.807

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Aztec Data Supply Inc.

USA . 2,780 parts In-Stock

1+ parts

$2.810

100+ parts

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2,780

$2.810

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Semicontronic

India . 1,040 parts In-Stock

1+ parts

$7.800

100+ parts

$7.605

1k+ parts

$7.566

10k+ parts

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1,040

$7.800

$7.605

$7.566

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Ampacity Inc.

Singapore . 619 parts In-Stock

1+ parts

$9.800

100+ parts

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619

$9.800

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One Stop Electronics

USA . 475 parts In-Stock

1+ parts

$13.800

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475

$13.800

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AZTECH Wire

Italy . 305 parts In-Stock

1+ parts

$17.753

100+ parts

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305

$17.753

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QUARKTWIN TECHNOLOGY LTD

USA . 8,943 parts In-Stock

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8,943

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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UNI Independent Distributors

Spain . 3,436 parts In-Stock

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3,436

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Corphita

USA . 1,836 parts In-Stock

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1,836

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Perfect Parts

USA . 1,176 parts In-Stock

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1,176

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Overview

Discover the SA605DK/01,112 by NXP Semiconductors, a high-quality receiver IC that offers exceptional value and benefits to customers. Designed with cutting-edge technology, this audio single chip receiver delivers outstanding performance and reliability. Its compact size and surface mount package make it perfect for various applications. With a wide operating temperature range and excellent signal-to-noise ratio, the SA605DK/01,112 ensures superior audio quality even in challenging industrial environments. Trust NXP Semiconductors, a renowned manufacturer, for top-notch products that meet your needs. Experience the advantages of the SA605DK/01,112 and elevate your audio systems to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external factors, ensuring the longevity of the receiver IC.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and facilitating mass production.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to handle during assembly and soldering processes.

General IC Type: AUDIO SINGLE CHIP RECEIVER

Audio single chip receiver design simplifies circuitry, reducing component count and power consumption.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting external components and peripherals for enhanced functionality.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Small outline, low profile, shrink pitch package style saves space on the PCB and enables compact device designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the receiver IC can withstand demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in harsh conditions, making it suitable for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance for long-term performance.

Terminal Position: DUAL

Dual terminal position enhances connectivity options and facilitates efficient signal routing.

Maximum Seated Height: 1.5 mm

Low maximum seated height allows for slim device profiles and enables sleek product designs.

Nominal Signal to Noise Ratio (FM): 73 dB

High signal to noise ratio ensures clear audio reception, resulting in improved audio quality.

Width: 4.4 mm

Narrow width contributes to space-saving design considerations and facilitates compact product layouts.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement promotes energy efficiency and extends battery life in portable devices.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance simplifies the manufacturing process and ensures reliable soldering results.

Length: 6.5 mm

Compact length dimension allows for flexibility in placement within electronic devices while conserving space.

Demodulation Type: FM

FM demodulation offers efficient signal processing for clear and reliable audio reception in FM broadcasting applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures consistent performance in challenging operating environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and assembly processes, enhancing manufacturing efficiency.

Nominal Output Voltage (FM): 150 mV

Stable nominal output voltage ensures consistent signal strength for reliable audio output in FM reception.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density PCB layouts, enabling compact and feature-rich electronic devices.

Maximum Supply Voltage (Vsup): 8 V

High maximum supply voltage rating provides flexibility in power input options, accommodating various system requirements.

Technical Specifications

Receiver ICs SA605DK/01,112 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

Additional Features:

IN-BUILT QUADRATURE DETECTOR

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

150 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Signal to Noise Ratio (FM):

73 dB

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA605DK/01,112 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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