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LA75676V

Onsemi

LA75676V by Onsemi

LA75676V by Onsemi is a Receiver IC with 24 terminals, operating at temperatures from -20 °C to 70°C. It features a power supply of 5V and is designed for audio/video demodulation applications. This surface-mount IC comes in a small outline package made of plastic/epoxy, suitable for commercial-grade temperature requirements.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,162 parts In-Stock

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Digiode

USA . 1,355 parts In-Stock

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1,355

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Distributors (Availability)

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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TANS Electronics

Latvia . 4,414 parts In-Stock

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SupplyDigital Components

Austria . 3,023 parts In-Stock

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Kulean Microsystems

USA . 2,769 parts In-Stock

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Problanco Electronics

Mexico . 1,267 parts In-Stock

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Corphita

USA . 1,228 parts In-Stock

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UHIMA Technologies

Türkiye . 236 parts In-Stock

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Corohmni

South Africa . 89 parts In-Stock

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Overview

Experience unparalleled audio and video quality with the LA75676V by Onsemi. As a leading manufacturer in the industry, Onsemi's Receiver ICs are designed for top-notch performance and reliability. Ideal for a wide range of applications, this Audio/Video Demodulator offers customers exceptional value and benefits. From its sleek design to its advanced technology, the LA75676V delivers superior results that exceed expectations. Trust Onsemi to provide you with the best in class products for all your audio and video needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the IC, ensuring a longer lifespan and reliability.

Surface Mount: YES

Being surface mountable makes it easier to integrate into circuit boards, saving space and enhancing production efficiency.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and alignment within a circuit design.

General IC Type: AUDIO/VIDEO DEMODULATOR

Specifically designed for audio/video demodulation, ensuring high-quality signal processing.

Power Supplies (V): 5

Operating at 5V offers compatibility with standard power supplies, making it versatile for various applications.

No. of Terminals: 24

Having 24 terminals allows for multiple connections, enabling complex circuit design and functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on the PCB, ideal for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the IC can withstand high temperature environments, improving overall reliability.

Minimum Operating Temperature: -20 °C

Operating at temperatures as low as -20 °C ensures functionality even in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit board layout and connection options.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable performance in standard operating conditions.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto PCBs, simplifying the assembly process.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, it allows for precise and compact connections, ideal for miniaturized designs.

Technical Specifications

Receiver ICs LA75676V attributes and parameters. Explore more Receiver ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

LA75676V General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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