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LA1787NM

Onsemi

LA1787NM by Onsemi

LA1787NM by Onsemi is an audio single chip receiver with 0.3% harmonic distortion. It operates in industrial temperature range (-40 to 85 °C) and has a signal to noise ratio of 82 dB for FM. With a package style of flatpack, it is suitable for applications requiring high-quality audio reception.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,412 parts In-Stock

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Vyrian

USA . 1,041 parts In-Stock

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1,041

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Problanco Electronics

Mexico . 7,615 parts In-Stock

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TANS Electronics

Latvia . 5,107 parts In-Stock

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Kulean Microsystems

USA . 3,049 parts In-Stock

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Corphita

USA . 2,363 parts In-Stock

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SupplyDigital Components

Austria . 792 parts In-Stock

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UHIMA Technologies

Türkiye . 453 parts In-Stock

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Corohmni

South Africa . 115 parts In-Stock

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Overview

Enhance your audio experience with the LA1787NM by Onsemi! As a leading manufacturer in receiver ICs, Onsemi delivers exceptional quality and reliability in their products. Ideal for a wide range of applications, this audio single chip receiver boasts a low harmonic distortion of 0.3% and a high signal to noise ratio of 82 dB, ensuring crystal clear sound. With a compact package style and industrial temperature grade, the LA1787NM offers customers a valuable solution for their audio needs, providing superior performance and efficiency. Elevate your audio system with the LA1787NM today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount capability allows for easy integration into compact electronic designs, saving space on the PCB.

Package Shape: SQUARE

Square package shape ensures easy handling and efficient placement on the circuit board.

General IC Type: AUDIO SINGLE CHIP RECEIVER

This single chip receiver simplifies the design by integrating multiple functions, reducing overall system cost and complexity.

Harmonic Distortion: 0.3 %

Low harmonic distortion ensures high-quality audio output, providing clear and crisp sound.

No. of Terminals: 64

A higher number of terminals offer more connectivity options and flexibility in the circuit design.

Package Style (Meter): FLATPACK

Flatpack package style allows for easy PCB mounting and heat dissipation, improving overall system performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in cold environments without sacrificing performance.

Terminal Position: QUAD

Quad terminal position enables secure and stable connection with the circuit board, enhancing reliability.

Maximum Seated Height: 3 mm

Low seated height facilitates compact design and space-saving in the overall product assembly.

Nominal Signal to Noise Ratio (FM): 82 dB

High signal-to-noise ratio in FM reception ensures minimal interference and clear audio output.

Width: 14 mm

Compact width dimension enables easy integration into small electronic devices and saves space on the PCB.

Minimum Supply Voltage (Vsup): 7.5 V

Low minimum supply voltage requirement allows for efficient power consumption and extended battery life.

Length: 14 mm

Short length dimension enables flexible placement on the PCB and facilitates compact system design.

Nominal Output Voltage (AM): 195 mV

Stable and consistent output voltage in AM demodulation ensures reliable performance in audio signal reception.

Demodulation Type: AM/FM

Support for both AM and FM demodulation types allows for versatile use in various audio signal processing applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specification ensures reliable operation in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form provides easy soldering and secure connection on the PCB, enhancing overall reliability.

Nominal Output Voltage (FM): 310 mV

High output voltage in FM demodulation ensures strong audio signal reception and improved sound quality.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for compact terminal placement on the PCB, optimizing space utilization and enhancing connectivity.

Maximum Supply Voltage (Vsup): 9 V

High maximum supply voltage capability provides flexibility in power input options and allows for stable operation under varying voltage conditions.

Technical Specifications

Receiver ICs LA1787NM attributes and parameters. Explore more Receiver ICs devices from Onsemi

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.3 %

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (AM):

195 mV

Nominal Output Voltage (FM):

310 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

3 mm

Nominal Signal to Noise Ratio (FM):

82 dB

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LA1787NM General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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